Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure

Patent metadata

Field	Value
Publication number	US-11961831-B2
Application number	US-202117408297-A
Country	US
Kind code	B2
Filing date	Aug 20, 2021
Priority date	Aug 20, 2021
Publication date	Apr 16, 2024
Grant date	Apr 16, 2024

Abstract

An electronic package, a semiconductor package structure and a method for manufacturing the same are provided. The electronic package includes a carrier, a first electronic component, an electrical extension structure, and an encapsulant. The carrier has a first face and a second face opposite to the first face. The first electronic component is adjacent to the first face of the carrier. The electrical extension structure is adjacent to the first face of the carrier and defines a space with the carrier for accommodating the first electronic component, the electrical extension structure is configured to connect the carrier with an external electronic component. The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure.

First claim

What is claimed is:

1. An electronic package, comprising:
a carrier having a first face and a second face opposite to the first face;
a first electronic component adjacent to the first face of the carrier;
an electrical extension structure adjacent to the first face of the carrier and defining a space with the carrier for accommodating the first electronic component, wherein the electrical extension structure is configured to connect the carrier with an external electronic component; and
an encapsulant encapsulating the first electronic component and at least a portion of the electrical extension structure,
wherein the carrier comprises a first opening connecting the first face and the second face, and a first type bonding wire passes through the first opening and connects to the first electronic component.

2. The electronic package of claim 1 , further comprising:
a second electronic component adjacent to the second face of the carrier, wherein the first type bonding wire connects the first electronic component and the second electronic component.

3. The electronic package of claim 2 , further comprising:
a second type bonding wire passing through the first opening and connecting the first electronic component with the carrier,
wherein the first type bonding wire comprises a plurality of bonding wires, and the second type bonding wire comprises a plurality of bonding wires.

4. The electronic package of claim 1 , wherein a side surface of the electrical extension structure is exposed from the encapsulant and configured as a wettable flank.

5. The electronic package of claim 1 , further comprising:
a second electronic component and a third electronic component disposed within the first opening of the carrier, wherein the first electronic component, the second electronic component and the third electronic component are vertically overlapped to each other.

6. The electronic package of claim 5 , wherein the first electronic component has a first terminal over an active surface of the first electronic component, the second electronic component has a second terminal proximal to an active surface of the second electronic component, and the first terminal is connected to the second terminal.

7. The electronic package of claim 1 , further comprising:
a second electronic component adjacent to the second face of the carrier,
wherein the first type bonding wire electrically connects the first electronic component with the second electronic component, a first end of the first type bonding wire bonded to the first electronic component, and a second end of the first type bonding wire bonded to the second electronic component.

8. The electronic package of claim 1 , wherein a portion of the encapsulant is disposed in the first opening.

9. The electronic package of claim 1 , wherein the electrical extension structure has a first surface spaced apart from the first face of the carrier, and the encapsulant has a surface substantially aligned with the first surface of the electrical extension structure.

10. The electronic package of claim 9 , wherein the electrical extension structure has a second surface extending between the first face of the carrier and the first surface of the electrical extension structure, and the second surface of the electrical extension structure is exposed by the encapsulant.

11. The electronic package of claim 1 , wherein the carrier further comprises:
a second opening connecting the first face and the second face, wherein the second opening is located between a second electronic component and a third electronic component, and a third type bonding wire passes through the second opening and connects the first electronic component and the second electronic component.

12. A semiconductor package structure, comprising:
a carrier having a first face and a second face opposite to the first face, the first face being configured to connect the carrier with an external circuit structure;
a first electronic component adjacent to the first face of the carrier;
a second electronic component adjacent to the second face of the carrier;
a first opening in the carrier, connecting the first face and the second face;
a first bonding wire passing through the first opening and having a first end bonded to the first electronic component and a second end bonded to the second electronic component; and
a second bonding wire passing through the first opening and having a first end bonded to the first electronic component and a second end bonded to the carrier.

13. The semiconductor package structure of claim 12 , further comprising:
a second opening in the carrier, connecting the first face and the second face;
a third bonding wire passing through the second opening and having a first end bonded to the first electronic component and a second end bonded to the second electronic component; and
a fourth bonding wire passing through the second opening and having a first end bonded to the first electronic component and a second end bonded to the carrier.

14. The semiconductor package structure of claim 12 , further comprising:
a plurality of conductive pillars at the first face of the carrier and around the first electronic component; and
an encapsulant encapsulating the first electronic component and the plurality of conductive pillars,
wherein a height of at least one of the plurality of conductive pillars is greater than a thickness of the first electronic component.

15. The semiconductor package structure of claim 14 , further comprising:
a redistribution structure stacked with the plurality of conductive pillars, the first electronic component, and the encapsulant, wherein the first electronic component is electrically connecting the carrier and the redistribution layer via a through via which is embedded within the first electronic component.

16. The semiconductor package structure of claim 14 , further comprising:
a conductive terminal connected to the plurality of conductive pillars, wherein the conductive terminal does not overlap the first electronic component in plain view.

17. The semiconductor package structure of claim 14 , wherein the encapsulant comprises a first portion encapsulating the first electronic component and the plurality of conductive pillars and a second portion encapsulating the second electronic component, and wherein a width of the first portion is substantially equal to that of the second portion.

18. A method of manufacturing a semiconductor package structure, comprising:
providing a carrier having a first face and a second face opposite to the first face, the carrier defining a first opening connecting the first face and the second face of the carrier;
forming an electrical extension structure at the first face of the carrier;
attaching a first electronic component adjacent to the first face of the carrier;
encapsulating the first electronic component and the electrical extension structure by a molding operation;
attaching a second electronic component adjacent to the second face of the carrier; and
forming a first bonding wire having a first end bonded to the first electronic component and a second end bonded to the second electronic component, wherein the first bonding wire passes through the first opening of the carrier.

19. The method of manufacturing a semiconductor package structure of claim 18 , further comprising:
connecting the carrier to an external circuit structure after encapsulating the first electronic component and the electrical extension structure.

Assignees

• Advanced Semiconductor Eng

Inventors

• Yen You-Lung
• Appelt Bernd Karl

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/751

  of bond wires · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/01

  Manufacture or treatment · CPC title