Semiconductor package and method of fabricating the same
US-2025253221-A1 · Aug 7, 2025 · US
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Park Jung-Ho patents
Park Jung-Ho is listed as an inventor on 64 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Park Jung-Ho |
| Total patents | 64 |
| First publication | Jan 22, 2015 |
| Latest publication | Aug 7, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package
US-12300589-B2 · May 13, 2025 · US
Methods of fabricating semiconductor package
US-12046526-B2 · Jul 23, 2024 · US
Novel peptide having anti-inflammatory and tissue regenerative actions
US-2024209022-A1 · Jun 27, 2024 · US
Semiconductor package
US-12009277-B2 · Jun 11, 2024 · US
Semiconductor package
US-2023420402-A1 · Dec 28, 2023 · US
Semiconductor package with thick under-bump terminal
US-11791295-B2 · Oct 17, 2023 · US
Method for fabricating semiconductor package
US-11715645-B2 · Aug 1, 2023 · US
Motor-driven door latch for vehicle
US-11668121-B2 · Jun 6, 2023 · US
Method for fabricating a semiconductor package
US-11515260-B2 · Nov 29, 2022 · US
Recent patents
Latest publications not already listed above.
Semiconductor package
US-2022352050-A1 · Nov 3, 2022 · US
Methods of fabricating semiconductor package
US-2022262696-A1 · Aug 18, 2022 · US
Semiconductor package
US-11404346-B2 · Aug 2, 2022 · US
Method for fabricating semiconductor package
US-2022216068-A1 · Jul 7, 2022 · US
Methods of fabricating semiconductor package
US-11328970-B2 · May 10, 2022 · US
Method for fabricating semiconductor package
US-11322368-B2 · May 3, 2022 · US
Semiconductor package and method of fabricating the same
US-2022077041-A1 · Mar 10, 2022 · US
Apparatus and method for controlling built-in microphone of portable terminal
US-11233894-B2 · Jan 25, 2022 · US
Semiconductor package
US-11121064-B2 · Sep 14, 2021 · US
Method for fabricating semiconductor package
US-2021257223-A1 · Aug 19, 2021 · US
Methods of fabricating semiconductor package
US-2021066149-A1 · Mar 4, 2021 · US
Semiconductor package
US-2021057317-A1 · Feb 25, 2021 · US
Method for fabricating a semiconductor package
US-2021050298-A1 · Feb 18, 2021 · US
Motor-Driven Door Latch for Vehicle
US-2021025204-A1 · Jan 28, 2021 · US
Semiconductor package
US-2021028137-A1 · Jan 28, 2021 · US
Semiconductor package
US-2020411405-A1 · Dec 31, 2020 · US
Apparatus and method for controlling built-in microphone of portable terminal
US-2020280627-A1 · Sep 3, 2020 · US
Apparatus and method for controlling built-in microphone of portable terminal
US-10674002-B2 · Jun 2, 2020 · US
Apparatus and method for controlling built-in microphone of portable terminal
US-2019289113-A1 · Sep 19, 2019 · US
Apparatus and method for controlling built-in microphone of portable terminal
US-10334093-B2 · Jun 25, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 50 |
| Univ Sungkyunkwan Res & Bus | 5 |
| Research & Business Found Sungkyunkwan Univ | 4 |
| Park Jung-Ho | 3 |
| Samsung Display Co Ltd | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 24 |
| H10W90/701 | 24 |
| H10W74/117 | 22 |
| H10W72/252 | 20 |
| H10W70/60 | 20 |