Interconnect Structure of Semiconductor Device
US-2025259889-A1 · Aug 14, 2025 · US
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Liu Yao-Min patents
Liu Yao-Min is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Liu Yao-Min |
| Total patents | 23 |
| First publication | Oct 13, 2015 |
| Latest publication | Aug 14, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor devices and methods of formation
US-12354958-B2 · Jul 8, 2025 · US
Method of making semiconductor device having a contact structure
US-2025183161-A1 · Jun 5, 2025 · US
Interconnect structure of semiconductor device
US-12322649-B2 · Jun 3, 2025 · US
Semiconductor device having a contact structure
US-12237261-B2 · Feb 25, 2025 · US
Ruthenium-based liner for a copper interconnect
US-2024387256-A1 · Nov 21, 2024 · US
Semiconductor devices and methods of formation
US-2024387381-A1 · Nov 21, 2024 · US
Ruthenium-based liner for a copper interconnect
US-12094770-B2 · Sep 17, 2024 · US
Method of making a contact structure
US-11996361-B2 · May 28, 2024 · US
Semiconductor devices and methods of formation
US-2023299002-A1 · Sep 21, 2023 · US
Recent patents
Latest publications not already listed above.
Semiconductor device having a contact structure
US-2023275019-A1 · Aug 31, 2023 · US
Diffusion barrier for semiconductor device and method
US-11676898-B2 · Jun 13, 2023 · US
Contact structure and method of making
US-11652044-B2 · May 16, 2023 · US
Ruthenium-based liner for a copper interconnect
US-2023068398-A1 · Mar 2, 2023 · US
Semiconductor processing tool and method for passivation layer formation and removal
US-2023042277-A1 · Feb 9, 2023 · US
Interconnect structure of semiconductor device
US-11527476-B2 · Dec 13, 2022 · US
Method of making a contact structure
US-2022384338-A1 · Dec 1, 2022 · US
Diffusion Barrier for Semiconductor Device and Method
US-2022367376-A1 · Nov 17, 2022 · US
Contact structure and method of making
US-2022278040-A1 · Sep 1, 2022 · US
Interconnect Structure of Semiconductor Device
US-2022165616-A1 · May 26, 2022 · US
Interconnect structure of semiconductor device
US-2022084937-A1 · Mar 17, 2022 · US
Diffusion barrier for semiconductor device and method
US-2021391275-A1 · Dec 16, 2021 · US
Organic semiconductor material and thin-film transistor
US-9156947-B2 · Oct 13, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 22 |
| Au Optronics Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/42 | 21 |
| H10W20/425 | 21 |
| H10W20/035 | 21 |
| H01L23/5226 | 21 |
| H10W20/0765 | 19 |