Integrated circuit device
US-11929389-B2 · Mar 12, 2024 · US
This page is not indexed by search engines while we improve data quality.
Kim Youn-Soo patents
Kim Youn-Soo is listed as an inventor on 47 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kim Youn-Soo |
| Total patents | 47 |
| First publication | Jul 7, 2015 |
| Latest publication | Mar 12, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor devices and method of manufacturing the same
US-11588012-B2 · Feb 21, 2023 · US
Semiconductor device and method of manufacturing the same
US-11177263-B2 · Nov 16, 2021 · US
Integrated circuit device
US-2021273039-A1 · Sep 2, 2021 · US
Semiconductor devices and method of manufacturing the same
US-2021202693-A1 · Jul 1, 2021 · US
Integrated circuit device
US-11043553-B2 · Jun 22, 2021 · US
Semiconductor manufacturing apparatus
US-2021140048-A1 · May 13, 2021 · US
Semiconductor devices and method of manufacturing the same
US-10978552-B2 · Apr 13, 2021 · US
Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound
US-10913754-B2 · Feb 9, 2021 · US
Method of forming tin-containing material film and method of synthesizing a tin compound
US-10882873-B2 · Jan 5, 2021 · US
Recent patents
Latest publications not already listed above.
Method of forming a thin film
US-10752645-B2 · Aug 25, 2020 · US
Semiconductor device and method of manufacturing the same
US-2020243531-A1 · Jul 30, 2020 · US
Semiconductor device and method of manufacturing the same
US-10636795-B2 · Apr 28, 2020 · US
Method of forming thin film and method of manufacturing integrated circuit device using the same
US-10600643-B2 · Mar 24, 2020 · US
Integrated circuit device
US-2020091275-A1 · Mar 19, 2020 · US
Semiconductor devices and method of manufacturing the same
US-2019355806-A1 · Nov 21, 2019 · US
Methods of forming material layer
US-10468256-B2 · Nov 5, 2019 · US
Method of forming a thin film
US-2019292207-A1 · Sep 26, 2019 · US
Semiconductor device and method of manufacturing the same
US-2019267384-A1 · Aug 29, 2019 · US
Lanthanum compound, method of synthesizing lanthanum compound, lanthanum precursor composition, method of forming thin film, and method of manufacturing integrated circuit device
US-10329312-B2 · Jun 25, 2019 · US
Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compound
US-2019152996-A1 · May 23, 2019 · US
Semiconductor device and method of manufacturing the same
US-10297600-B2 · May 21, 2019 · US
Method of forming tin-containing material film and method of synthesizing a tin compound
US-2019144472-A1 · May 16, 2019 · US
Method of forming thin film and method of manufacturing integrated circuit device using the same
US-2018342391-A1 · Nov 29, 2018 · US
Methods of forming material layer
US-10103026-B2 · Oct 16, 2018 · US
Semiconductor device and method of manufacturing the same
US-2018240800-A1 · Aug 23, 2018 · US
Tin compound, method of synthesizing the same, tin precursor compound for atomic layer deposition, and method of forming tin-containing material film
US-2018155372-A1 · Jun 7, 2018 · US
Semiconductor device and method of manufacturing the same
US-9978753-B2 · May 22, 2018 · US
Organometallic precursors and methods of forming thin layers using the same
US-9941114-B2 · Apr 10, 2018 · US
Method for changing display range and electronic device thereof
US-9851898-B2 · Dec 26, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 48 |
| Adeka Corp | 5 |
| Dnf Co Ltd | 3 |
| Namlab Ggmbh | 2 |
| Chung Suk-Jin | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B12/315 | 25 |
| H10D1/716 | 22 |
| H01L27/10814 | 20 |
| C23C16/405 | 18 |
| H10B12/30 | 18 |