Thin recon interposer package without TSV for fine input/output pitch fan-out
US-10615110-B2 · Apr 7, 2020 · US
This page is not indexed by search engines while we improve data quality.
Khan Rezaur Rahman patents
Khan Rezaur Rahman is listed as an inventor on 46 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Khan Rezaur Rahman |
| Total patents | 46 |
| First publication | Jan 6, 2015 |
| Latest publication | Apr 7, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Thin recon interposer package without tsv for fine input/output pitch fan-out
US-2018308791-A1 · Oct 25, 2018 · US
Heat spreader having thermal interface material retainment
US-10079191-B2 · Sep 18, 2018 · US
Reconstituted interposer semiconductor package
US-2018233440-A1 · Aug 16, 2018 · US
Thin recon interposer package without TSV for fine input/output pitch fan-out
US-10008439-B2 · Jun 26, 2018 · US
High density redistribution layer (rdl) interconnect bridge using a reconstituted wafer
US-2017365565-A1 · Dec 21, 2017 · US
Wafer level system in package (SiP) using a reconstituted wafer and method of making
US-9842827-B2 · Dec 12, 2017 · US
Fan-out 3D IC integration structure without substrate and method of making the same
US-9837378-B2 · Dec 5, 2017 · US
Wafer level system in package (sip) using a reconstituted wafer and method of making
US-2017301651-A1 · Oct 19, 2017 · US
Magnetic-core three-dimensional (3D) inductors and packaging integration
US-9693461-B2 · Jun 27, 2017 · US
Recent patents
Latest publications not already listed above.
Fan-out 3D IC Integration Structure without Substrate and Method of Making the Same
US-2017117251-A1 · Apr 27, 2017 · US
Heat Spreader Having Thermal Interface Material Retainment
US-2017110384-A1 · Apr 20, 2017 · US
Semiconductor interposer having a cavity for intra-interposer die
US-9548251-B2 · Jan 17, 2017 · US
Thin Recon Interposer Package Without TSV for Fine Input/Output Pitch Fan-Out
US-2017011993-A1 · Jan 12, 2017 · US
Semiconductor package with a bridge interposer
US-9431371-B2 · Aug 30, 2016 · US
Compliant dielectric layer for semiconductor device
US-9431370-B2 · Aug 30, 2016 · US
Interposer package-on-package structure
US-9406636-B2 · Aug 2, 2016 · US
Interconnect structure for molded ic packages
US-2016190057-A1 · Jun 30, 2016 · US
Stacked packaging using reconstituted wafers
US-2016155728-A1 · Jun 2, 2016 · US
Method and Apparatus for Cooling Semiconductor Device Hot Blocks and Large Scale Integrated Circuit (IC) Using Integrated Interposer for IC Packages
US-2016148890-A1 · May 26, 2016 · US
Mutual capacitance and magnetic field distribution control for transmission lines
US-9338880-B2 · May 10, 2016 · US
Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
US-9299634-B2 · Mar 29, 2016 · US
Stacked packaging using reconstituted wafers
US-9293393-B2 · Mar 22, 2016 · US
Flexible routing for chip on board applications
US-9287189-B2 · Mar 15, 2016 · US
System-in-package with integrated socket
US-9275976-B2 · Mar 1, 2016 · US
Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections
US-9236442-B2 · Jan 12, 2016 · US
Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding
US-9230875-B2 · Jan 5, 2016 · US
Reconstituted interposer semiconductor package
US-2015340308-A1 · Nov 26, 2015 · US
Reconstitution techniques for semiconductor packages
US-2015303172-A1 · Oct 22, 2015 · US
Magnetic-core three-dimensional (3d) inductors and packaging integration
US-2015302974-A1 · Oct 22, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Broadcom Corp | 39 |
| Khan Rezaur Rahman | 11 |
| Zhao Sam Ziqun | 10 |
| Avago Technologies General Ip | 7 |
| Hu Kevin Kunzhong | 7 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 38 |
| H10W90/00 | 29 |
| H10W90/734 | 27 |
| H10W72/252 | 24 |
| H10W74/00 | 22 |