System-in-package with integrated socket

Patent metadata

Field	Value
Publication number	US-9275976-B2
Application number	US-201213405207-A
Country	US
Kind code	B2
Filing date	Feb 24, 2012
Priority date	Feb 24, 2012
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

There are disclosed herein various implementations of a system-in-package with integrated socket. In one such implementation, the system-in-package includes a first active die having a first plurality of electrical connectors on a top surface of the first active die, an interposer situated over the first active die, and a second active die having a second plurality of electrical connectors on a bottom surface of the second active die. The interposer is configured to selectively couple at least one of the first plurality of electrical connectors to at least one of the second plurality of electrical connectors. In addition, a socket encloses the first and second active dies and the interposer, the socket being electrically coupled to at least one of the first active die, the second active die, and the interposer.

First claim

The invention claimed is:

1. A system-in-package comprising:
a first active die having a first plurality of disjoint electrical connectors on a top surface of said first active die;
an interposer situated over said first active die;
a second active die having a second plurality of disjoint electrical connectors on a bottom surface of said second active die;
said interposer selectively couple at least one of said first plurality of disjoint electrical connectors to at least one of said second plurality of disjoint electrical connectors;
an electrically conductive heat sink enclosure enclosing said first and second active dies and said interposer, said electrically conductive heat sink enclosure being electrically coupled to said first active die, said second active die, and said interposer; and
an electrically conductive socket contact between, and in physical contact with, the electrically conductive heat sink enclosure and a first side wall of at least one of the first active die, the second active die, or the interposer.

2. The system-in-package of claim 1 , wherein said interposer comprises at least one selectively conductive polymer film that comprises a polymer matrix having nano-wires or nanotubes dispersed therein.

3. The system-in-package of claim 1 , wherein said electrically conductive heat sink enclosure is configured to:
shield said first active die, said second active die, and said interposer from electromagnetic interference;
provide a common package ground for the first active die, the second active die, and the interposer; and
provide a heat sink for the first active die, the second active die, and the interposer.

4. A system-in-package comprising:
a first active die having a first plurality of electrical connectors on a top surface of said first active die;
an interposer situated over said first active die;
a second active die having a second plurality of electrical connectors on a bottom surface of said second active die;
said interposer selectively couple at least one of said first plurality of electrical connectors to at least one of said second plurality of electrical connectors;
an electrically conductive heat sink enclosure enclosing said first and second active dies and said interposer, said electrically conductive heat sink enclosure being electrically coupled to said first active die, said second active die, and said interposer; and
an electrically conductive socket contact between, and in physical contact with, the electrically conductive heat sink enclosure and a first side wall of at least one of the first active die, the second active die, or the interposer.

5. The system-in-package of claim 4 , wherein said interposer comprises a selectively conductive polymer film.

6. The system-in-package of claim 4 , wherein said electrically conductive heat sink enclosure is configured to shield said first active die, said second active die, and said interposer.

7. The system-in-package of claim 4 , wherein said electrically conductive heat sink enclosure is configured to provide a common package ground for said first active die, said second active die, and said interposer.

8. The system-in-package of claim 4 , wherein said electrically conductive heat sink enclosure is configured to provide a heat sink for said first active die, said second active die, and said interposer.

9. The system-in-package of claim 4 , wherein said interposer comprises a selectively conductive polymer film that comprises a polymer matrix having nano-wires or nanotubes dispersed therein.

10. The system-in-package of claim 4 , wherein said interposer comprises a selectively conductive polymer film that comprises a polymer matrix having conductive bodies dispersed therein.

11. The system-in-package of claim 4 , wherein said interposer comprises a selectively conductive polymer film that comprises an anisotropic conductive film (ACF).

12. The system-in-package of claim 4 , further comprising another socket contact between the electrically conductive heat sink enclosure and a second side wall of the at least one of the first active die, the second active die, or the interposer, the second side wall being opposite the first side wall.

13. The system-in-package of claim 4 , wherein:
the electrically conductive socket contact is in physical contact with the first side wall of one of the first active die, the second active die, or the interposer, and
the electrically conductive socket contact is nonadjacent to the first side wall of remaining two of the first active die, the second active die, and the interposer.

14. The system-in-package of claim 4 , wherein the electrically conductive socket contact is in physical contact with less than an entirety of the first side wall of the at least one of the first active die, the second active die, or the interposer.

15. The system-in-package of claim 4 , further comprising an adhesion layer in physical contact with the electrically conductive heat sink enclosure, wherein the electrically conductive socket contact is nonadjacent to the adhesion layer.

16. The system-in-package of claim 4 , wherein:
the interposer comprises a first through-interposer connection and a second through-interposer connection, and
the first through-interposer connection is wider than the second through-interposer connection.

17. A method for producing a system-in-package, said method comprising:
providing a first active die having a first plurality of electrical connectors on a top surface of said first active die;
placing an interposer over said first active die;
placing a second active die over said interposer, said second active die having a second plurality of electrical connectors on a bottom surface of said second active die;
utilizing said interposer to selectively couple, via conductive bodies in the interposer, at least one of said first plurality of electrical connectors to at least one of said second plurality of electrical connectors, wherein the conductive bodies have been oriented by a field; and
enclosing in an electrically conductive heat sink enclosure said first and second active dies and said interposer, said electrically conductive heat sink enclosure being electrically coupled to said first active die, said second active die, and said interposer.

18. The method of claim 17 , wherein said interposer comprises at least one selectively conductive polymer film that comprises a polymer matrix having nano-wires or nanotubes dispersed therein.

19. The method of claim 17 , wherein said electrically conductive heat sink enclosure is configured to:
shield said first active die, said second active die, and said interposer from electromagnetic interference;
provide a common package ground for the first active die, the second active die, and the interposer; and
provide a heat sink for the first active die, the second active die, and the interposer.

20. The method of claim 17 , further comprising applying an electromagnetic field to the interposer to selectively orient the field-oriented conductive bodies to selectively form at least one connection in the interposer that couples the at least one of the first plurality of electrical connectors to the at least one of the second plurality of electrical connectors.

Assignees

• Zhao Sam Ziqun
• Hu Kevin Kunzhong
• Karikalan Sampath K V
• Khan Rezaur Rahman
• Vorenkamp Pieter
• Chen Xiangdong
• Broadcom Corp

Inventors

• Zhao Sam Ziqun
• Hu Kevin Kunzhong
• Karikalan Sampath K V
• Khan Rezaur Rahman
• Vorenkamp Pieter
• Chen Xiangdong

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title