Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding

Patent metadata

Field	Value
Publication number	US-9230875-B2
Application number	US-201414260872-A
Country	US
Kind code	B2
Filing date	Apr 24, 2014
Priority date	Sep 28, 2011
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

Embodiments of provide an integrated circuit (IC) device. The IC device can include a substrate having first and second opposing surfaces, an IC die electrically coupled to the first surface of the substrate, a plurality of contact members coupled to the first surface of the substrate, and an interposer. The interposer can include a plurality of contact elements located on a first surface thereof, each conductive element being coupled to a respective one of the plurality of contact members, and an antenna formed using a conductive layer of the interposer, the antenna being electrically coupled to the IC die through at least one of the plurality of contact elements and at least one of the plurality of contact members.

First claim

What is claimed:

1. An integrated circuit (IC) device, comprising:
a substrate having first and second opposing surfaces;
an IC die electrically coupled to the first surface of the substrate;
a plurality of contact members coupled to the first surface of the substrate; and
an interposer, comprising:
a plurality of contact elements located on a first surface of the interposer, each contact element of the plurality of contact elements being coupled to a respective one of the plurality of contact members; and
an antenna formed using a conductive layer of the interposer, the antenna being electrically coupled to the IC die through at least one of the plurality of contact elements and at least one of the plurality of contact members.

2. The IC device of claim 1 , wherein the antenna is configured to facilitate wireless communication between the IC die and another device, and wherein the other device comprises at least one of a cellular phone, a personal computer, a cellular tower, or a near field communication (NFC) scanning device.

3. The IC device of claim 1 , further comprising:
a mold compound disposed between the first surface of the substrate and the first surface of the interposer, wherein a surface of each of the plurality of contact members is substantially flush with a surface of the mold compound, and wherein the mold compound encases the IC die.

4. The IC device of claim 1 , wherein the antenna is formed on a second surface of the interposer, and wherein the second surface of the interposer opposes the first surface of the interposer.

5. The IC device of claim 1 , wherein the antenna is a first antenna, wherein the first antenna is located on a second surface of the interposer, wherein the second surface of the interposer opposes the first surface of the interposer, and wherein the IC device further comprises:
a second antenna located on the second surface of the interposer,
wherein the first antenna is configured for cellular applications and the second antenna is configured for non-cellular applications.

6. The IC device of claim 5 , wherein the second antenna is configured for multi-band applications.

7. The IC device of claim 1 , further comprising:
an inductor attached to a second surface of the interposer, wherein the second surface of the interposer opposes the first surface of the interposer.

8. The IC device of claim 7 , wherein the antenna and the inductor are configured to wirelessly harvest power.

9. The IC device of claim 1 , wherein the conductive layer is a first conductive layer, wherein the interposer further comprises a second conductive layer, and wherein the first and second conductive layers together form the antenna.

10. The IC device of claim 9 , wherein the antenna comprises at least one of a dipole antenna, a slot antenna, an antenna of an antenna array, or a microstrip antenna.

11. The IC device of claim 9 , wherein the interposer further comprises:
a micro electromechanical system (MEMS) turning element, the MEMS turning element being configured to tune a wireless communication element.

12. The IC device of claim 1 , wherein the interposer includes a frequency turning circuit, the frequency turning, circuit being configured to tune the antenna.

13. The IC device of claim 1 , wherein the interposer comprises a capacitor, the capacitor comprising at least a portion of the conductive layer.

14. The IC device of claim 1 , further comprising:
a capacitor attached to a second surface of the interposer, the second surface of the interposer opposing the first surface of the interposer.

15. An interposer, comprising:
a plurality of contact elements formed on a surface of the interposer configured to be coupled to an integrated circuit (IC) die of an IC device through respective ones of a plurality of contact members of an IC package; and
an antenna formed using a conductive layer of the interposer, the antenna being, electrically coupled to the IC die through at least one of the plurality of contact elements and at least one of the plurality of contact members.

16. The interposer of claim 15 , wherein the antenna is a first antenna, the interposer further comprising:
a second antenna, wherein the first antenna is configured for cellular applications and the second antenna is configured for non-cellular applications.

17. The interposer of claim 15 , wherein the surface of the interposer is a first surface, the interposer further comprising:
an inductor attached to a second surface of the interposer, wherein the second surface of the interposer opposes the first surface of the interposer.

18. The interposer of claim 17 , wherein the antenna and the inductor are configured to wirelessly harvest power.

19. The interposer of claim 15 , wherein the conductive layer is a first conductive layer, wherein the interposer further comprises a second conductive layer, and wherein the first and second conductive layers together form the antenna.

20. The interposer of claim 15 , further comprising:
a frequency turning circuit configured to tune the antenna.

Assignees

• Broadcom Corp

Inventors

• Zhao Sam Ziqun
• Khan Rezaur Rahman

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title