Power chip package structure
US-2026047480-A1 · Feb 12, 2026 · US
This page is not indexed by search engines while we improve data quality.
Hsieh Yu-Te patents
Hsieh Yu-Te is listed as an inventor on 56 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hsieh Yu-Te |
| Total patents | 56 |
| First publication | Sep 15, 2016 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Image sensor packaging structures and related methods
US-12532559-B2 · Jan 20, 2026 · US
Power chip package structure
US-2025336878-A1 · Oct 30, 2025 · US
Power chip package structure and manufacturing method thereof
US-2025309087-A1 · Oct 2, 2025 · US
Power chip package structure and manufacturing method thereof
US-2025293201-A1 · Sep 18, 2025 · US
Cavity package
US-2025287720-A1 · Sep 11, 2025 · US
Chip package structure and manufacturing method thereof
US-2025253197-A1 · Aug 7, 2025 · US
Image sensor package
US-12317628-B2 · May 27, 2025 · US
Semiconductor package structure and related methods
US-2025160014-A1 · May 15, 2025 · US
Semiconductor package structure and related methods
US-12237351-B2 · Feb 25, 2025 · US
Recent patents
Latest publications not already listed above.
Method for defining a gap height within an image sensor package
US-2025022898-A1 · Jan 16, 2025 · US
Image sensor package having a light blocking member
US-2024405043-A1 · Dec 5, 2024 · US
Method for defining a gap height within an image sensor package
US-12107105-B2 · Oct 1, 2024 · US
Optical sensor package
US-2024304639-A1 · Sep 12, 2024 · US
Image sensor package having a light blocking member
US-12068345-B2 · Aug 20, 2024 · US
Optical devices including glass cover with patterned antireflective coating
US-2024234456-A1 · Jul 11, 2024 · US
Method for defining a gap height within an image sensor package
US-2024038805-A1 · Feb 1, 2024 · US
Method for defining a gap height within an image sensor package
US-11869912-B2 · Jan 9, 2024 · US
Image sensor packaging structures and related methods
US-2023378209-A1 · Nov 23, 2023 · US
Image sensor package
US-2023343806-A1 · Oct 26, 2023 · US
Image sensor package having a light blocking member
US-2023025520-A1 · Jan 26, 2023 · US
Image sensor semiconductor packages and related methods
US-11508776-B2 · Nov 22, 2022 · US
Multi-chip packaging structure for an image sensor
US-11476292-B2 · Oct 18, 2022 · US
Image sensor package having a light blocking member
US-11444111-B2 · Sep 13, 2022 · US
Image sensor package having a cavity structure for a light-transmitting member
US-2022223641-A1 · Jul 14, 2022 · US
Image sensor package having inner and outer joint members
US-2022216255-A1 · Jul 7, 2022 · US
Method for defining a gap height within an image sensor package
US-2022020800-A1 · Jan 20, 2022 · US
Semiconductor package structure and related methods
US-2021305301-A1 · Sep 30, 2021 · US
Semiconductor package structure and related methods
US-11037970-B2 · Jun 15, 2021 · US
Multi-chip packaging structure for an image sensor
US-2020335544-A1 · Oct 22, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semiconductor Components Ind Llc | 51 |
| Tong Hsing Electronic Industries Ltd | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10F39/804 | 45 |
| H01L27/14618 | 33 |
| H10F39/811 | 31 |
| H10W90/734 | 24 |
| H10F39/809 | 24 |