Image sensor package having a cavity structure for a light-transmitting member

Patent metadata

Field	Value
Publication number	US-2022223641-A1
Application number	US-202117248209-A
Country	US
Kind code	A1
Filing date	Jan 14, 2021
Priority date	Jan 14, 2021
Publication date	Jul 14, 2022
Grant date	—

Abstract

According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, at least one conductor connected to the image sensor die and the substrate, and a light-transmitting member including a substrate member, a first leg member extending from a first edge portion of the substrate member, and a second leg member extending from a second edge portion of the substrate member, the first leg member being coupled to the substrate, the second leg member being coupled to the substrate.

First claim

What is claimed is:

1 . An image sensor package comprising:
a substrate; an image sensor die coupled to the substrate; at least one conductor connected to the image sensor die and the substrate; and a light-transmitting member including a substrate member, a first leg member extending from a first edge portion of the substrate member, and a second leg member extending from a second edge portion of the substrate member, the first leg member being coupled to the substrate, the second leg member being coupled to the substrate.

2 . The image sensor package of claim 1 , wherein the light-transmitting member includes a cavity that extends between the first leg member and the second leg member.

3 . The image sensor package of claim 2 , wherein the image sensor die is disposed within the cavity.

4 . The image sensor package of claim 2 , wherein at least a portion of the at least one conductor is disposed within the cavity.

5 . The image sensor package of claim 1 , wherein the first leg member is coupled to the substrate with a bonding material, and the second leg member is coupled to the substrate with a bonding material.

6 . The image sensor package of claim 1 , wherein the substrate member is a linear body having a length greater than a length of the image sensor die, the substrate member including a first surface and a second surface, the first leg member extending from the second surface at a first non-zero angle with respect to the second surface, the second leg member extending from the second surface at a second non-zero angle with respect to the second surface.

7 . The image sensor package of claim 6 , wherein the first non-zero angle is a perpendicular angle, and the second non-zero angle is a perpendicular angle.

8 . The image sensor package of claim 1 , further comprising:
an encapsulation material including a first portion that contacts at least a portion of the first leg member and a second portion that contacts at least a portion of the second leg member.

9 . The image sensor package of claim 1 , wherein the substrate includes a first surface and a second surface, the image sensor die being coupled to the first surface, the image sensor package further comprising:
a plurality of conductive components coupled to the second surface of the substrate, the plurality of conductive components configured to be connected to an external device.

10 . The image sensor package of claim 1 , wherein the image sensor package is an interstitial ball grid array (iBGA) package.

11 . An image sensor strip assembly having multiple image sensor packages, the image sensor strip assembly comprising:
a substrate; a first image sensor die coupled to a first portion of the substrate; a first light-transmitting member coupled to the first portion of the substrate, the first light-transmitting member including a substrate member, a first leg member extending from the substrate member, and a second leg member extending from the substrate member; a second image sensor die coupled to a second portion of the substrate; and a second light-transmitting member coupled to the second portion of the substrate, the second light-transmitting member including a substrate member, a first leg member extending from the substrate member, and a second leg member extending from the substrate member.

12 . The image sensor strip assembly of claim 11 , further comprising:
an encapsulation material including a portion disposed between the second leg member of the first light-transmitting member and the first leg member of the second light-transmitting member.

13 . The image sensor strip assembly of claim 12 , further comprising:
a third image sensor die coupled to a third portion of the substrate; and a third light-transmitting member coupled to the third portion of the substrate, the third light-transmitting member including a substrate member, a first leg member extending from the substrate member, and a second leg member extending from the substrate member, wherein the encapsulation material includes a portion disposed between the second leg member of the second light-transmitting member and the first leg member of the third light-transmitting member.

14 . The image sensor strip assembly of claim 11 , wherein the first leg member of the first light-transmitting member is coupled to the first portion of the substrate, and the second leg member of the first light-transmitting member is coupled to the first portion of the substrate.

15 . The image sensor strip assembly of claim 11 , further comprising:
at least one first conductor connected to the first image sensor die and the first portion of the substrate; and at least one second conductor connected to the second image sensor die and the second portion of the substrate.

16 . The image sensor strip assembly of claim 11 , wherein the first leg member of the first light-transmitting member is coupled to the first portion of the substrate with a bonding material, and the second leg member of the first light-transmitting member is coupled to the first portion of the substrate with a bonding material.

17 . The image sensor strip assembly of claim 11 , wherein the substrate member of the first light-transmitting member is a linear body having a length greater than a length of the first image sensor die, the substrate member of the first light-transmitting member including a first surface and a second surface, the first leg member of the first light-transmitting member extending from the second surface at a perpendicular angle with respect to the second surface, the second leg member of the first light-transmitting member extending from the second surface at a perpendicular angle with respect to the second surface.

18 . The image sensor strip assembly of claim 11 , wherein the substrate includes a first surface and a second surface, the first image sensor die being coupled to the first surface, the second image sensor die being coupled to the first surface, the image sensor strip assembly further comprising:
a plurality of solder balls coupled to the second surface of the substrate, the plurality of solder balls configured to be connected to an external device.

19 . A method of creating individual image sensor packages, the method comprising:
receiving an image sensor strip assembly, the image sensor strip assembly including:
a substrate;
a first image sensor die coupled to a first portion of the substrate;
a first light-transmitting member coupled to the first portion of the substrate, the first light-transmitting member including a substrate member, a first leg member extending from the substrate member, and a second leg member extending from the substrate member;
a second image sensor die coupled to a second portion of the substrate;
a second light-transmitting member coupled to the second portion of the substrate, the second light-transmitting member including a substrate member, a first leg member extending from the substrate member, and a second leg member extending from the substrate member; and
an encapsulation material including a portion disposed between the second leg member of the first light-transmitting member and the first leg member of the second light-transmitting member;
cutting the portion of the encapsulation material that is disposed between the second leg member of the first light-transmitting member and the first leg member of the second light-transmitting member; and cutting the substrate at a location between the first portion of the substrate

Assignees

• Semiconductor Components Ind Llc

Inventors

• Kinsman Larry Duane
• Hsieh Yu-Te

Classifications

• H10F71/137

  Batch treatment of the devices · CPC title

• H10F39/811

  Interconnections · CPC title

• H10F39/028

  performed after manufacture of the image sensors, e.g. annealing, gettering of impurities, short-circuit elimination or recrystallisation · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H01L27/14618 Primary

  Electricity · mapped topic