Optical devices including glass cover with patterned antireflective coating

Patent metadata

Field	Value
Publication number	US-2024234456-A1
Application number	US-202318153267-A
Country	US
Kind code	A1
Filing date	Jan 11, 2023
Priority date	Jan 11, 2023
Publication date	Jul 11, 2024
Grant date	—

Abstract

In a general aspect, a package includes a semiconductor die including an optical device having an optically active area on a first side of the semiconductor die. The package also includes a glass cover having an antireflective coating disposed on a central portion of a first side of the glass cover. A perimeter portion of the first side of the glass cover excludes the antireflective coating. The package further includes an adhesive resin coupling the perimeter portion of the first side of the glass cover with the first side of the semiconductor die, such that the glass cover is disposed above and spaced from the optically active area.

First claim

What is claimed is:

1 . A package comprising:
a semiconductor die including an optical device having an optically active area on a first side of the semiconductor die; a glass cover having an antireflective coating disposed on a central portion of a first side of the glass cover, a perimeter portion of the first side of the glass cover excluding the antireflective coating; and an adhesive resin coupling the perimeter portion of the first side of the glass cover with the first side of the semiconductor die, such that the glass cover is disposed above and spaced from the optically active area.

2 . The package of claim 1 , wherein the antireflective coating is disposed on a central portion of a second side of the glass cover that is opposite the first side of the glass cover, a perimeter portion of the second side of the glass cover excluding the antireflective coating, the second side of the glass cover being exposed outside the package.

3 . The package of claim 1 , wherein the glass cover, the adhesive resin and the semiconductor die define a hermetically sealed cavity, the optically active area of the semiconductor die being disposed within the hermetically sealed cavity.

4 . The package of claim 1 , wherein the adhesive resin is an ultraviolet light cured adhesive resin.

5 . The package of claim 1 , further comprising:
a substrate coupled with a second side of the semiconductor die that is opposite the first side of the semiconductor die; at least one wire bond electrically coupling the substrate with the semiconductor die; and a molding compound disposed on a portion of the substrate, the molding compound encapsulating the at least one wire bond.

6 . The package of claim 5 , wherein the at least one wire bond and the molding compound are disposed outside a hermetically sealed cavity defined by the glass cover, the adhesive resin and the semiconductor die.

7 . The package of claim 5 , wherein the substrate includes a ball-grid-array (BGA) substrate.

8 . A package comprising:
a semiconductor die including an image sensor having an optically active area on a first side of the semiconductor die; a substrate coupled with a second side of the semiconductor die that is opposite the first side of the semiconductor die; a glass cover having an antireflective coating disposed on:
a central portion of a first side of the glass cover; and
a central portion of a second side of the glass cover that is opposite the first side of the glass cover,
a perimeter portion of the first side of the glass cover and a perimeter portion of the second side of the glass cover excluding the antireflective coating; and
an adhesive resin coupling the perimeter portion of the first side of the glass cover with the first side of the semiconductor die, such that the glass cover is disposed above and spaced from the optically active area.

9 . The package of claim 8 , wherein the glass cover, the adhesive resin, and the semiconductor die define a hermetically sealed cavity, the optically active area of the semiconductor die being disposed within the hermetically sealed cavity.

10 . The package of claim 8 , wherein the adhesive resin is an ultraviolet light cured adhesive resin.

11 . The package of claim 8 , further comprising:
at least one wire bond electrically coupling the substrate with the semiconductor die; and a molding compound disposed on a portion of the substrate, the molding compound encapsulating the at least one wire bond.

12 . The package of claim 11 , wherein the at least one wire bond and the molding compound are disposed outside a hermetically sealed cavity defined by the glass cover, the adhesive resin and the semiconductor die.

13 . The package of claim 8 , wherein the substrate includes a ball-grid-array (BGA) substrate.

14 . The package of claim 8 , wherein the second side of the glass cover is exposed outside the package.

15 . The package of claim 8 , wherein the image sensor includes a complementary metal-oxide semiconductor (CMOS) image sensor.

16 . A method comprising:
coating with photoresist:
a first side of a glass cover for an optical device; and
a second side of the glass cover, the second side of the glass cover being opposite the first side of the glass cover;
exposing and developing the photoresist such that:
the photoresist is removed from respective central portions of the first side of the glass cover and the second side of the glass cover; and
the photoresist remains on respective perimeter portions of the first side of the glass cover and the second side of the glass cover;
coating the first side of the glass cover and the second side of the glass cover with a broadband antireflective (BBAR) coating; stripping the photoresist from the respective perimeter portions, the stripping removing the photoresist and the BBAR coating from the respective perimeter portions.

17 . The method of claim 16 , further comprising:
coupling, with an adhesive resin, the respective perimeter portion of the first side of the glass cover with a semiconductor die including the optical device, the glass cover being disposed above and spaced from an optically active area of the optical device; and curing the adhesive resin with ultraviolet light.

18 . The method of claim 16 , wherein coating the first side of the glass cover and the second side of the glass cover with the BBAR coating includes coating the first side of the glass cover and the second side of the glass cover using evaporative coating.

19 . The method of claim 16 , wherein the BBAR coating has a thickness between 1 nanometer (nm) and 100 nm.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Hsieh Yu-Te
• Lin Yusheng

Classifications

• H10W74/124

  the encapsulations having cavities other than that occupied by chips · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/43 Primary

  comprising oxides, nitrides or carbides, e.g. ceramics or glasses · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H10F39/024

  of coatings or optical elements · CPC title