Method for defining a gap height within an image sensor package

Patent metadata

Field	Value
Publication number	US-2025022898-A1
Application number	US-202418902029-A
Country	US
Kind code	A1
Filing date	Sep 30, 2024
Priority date	Jul 15, 2020
Publication date	Jan 16, 2025
Grant date	—

Abstract

According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light transmitting member, and a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member. A height of the plurality of pillar members defines a gap height between an active region of the image sensor die and the light transmitting member. The image sensor package including a bonding material that couples the light transmitting member to the image sensor. The bonding material contacts a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.

First claim

What is claimed is:

1 . A sensor package comprising:
a substrate; a sensor die coupled to the substrate; a transparent member; a plurality of pillar members disposed between and contacting the sensor die and the transparent member, the plurality of pillar members including a conductive material; and a bonding material that couples the transparent member to the sensor die, the bonding material contacting a side of a pillar member, of the plurality of pillar members.

2 . The sensor package of claim 1 , wherein the bonding material is disposed on a perimeter portion of a mount area of the sensor die, wherein each of the plurality of pillar members is located on a separate corner portion of the mount area of the sensor die.

3 . The sensor package of claim 1 , further comprising:
one or more bond wires coupled to the sensor die and the substrate.

4 . The sensor package of claim 1 , wherein the sensor die includes a plurality of contact terminals, the plurality of pillar members located between an active region of the sensor die and the plurality of pillar members.

5 . The sensor package of claim 1 , wherein the pillar member includes an L-shape.

6 . The sensor package of claim 1 , wherein the substrate includes a dielectric layer and conductive traces.

7 . The sensor package of claim 1 , further comprising:
an encapsulation material having a portion that contacts the bonding material, an edge portion of the sensor die, and an edge of the transparent member.

8 . The sensor package of claim 1 , wherein the pillar member is a first pillar member with a first height, the plurality of pillar members including a second pillar member with a second height, the second height being different from the first height.

9 . The sensor package of claim 1 , wherein a height of the plurality of pillar members defines a gap height between a pixel array of the sensor die and the transparent member.

10 . A sensor package comprising:
a substrate; a sensor die coupled to the substrate; a transparent member; a plurality of pillar members disposed between and contacting the sensor die and the transparent member, the plurality of pillar members forming an air gap between the transparent member and the sensor die; a bonding material that couples the transparent member to the sensor die, the bonding material contacting a side of a pillar member, of the plurality of pillar members; an encapsulation material having a portion that contacts the bonding material, an edge portion of the sensor die, and an edge of the transparent member.

11 . The sensor package of claim 10 , wherein the plurality of pillar members includes a conductive material.

12 . The sensor package of claim 10 , wherein the bonding material is disposed on a perimeter portion of a mount area of the sensor die, each of the plurality of pillar members located on a separate corner portion of the mount area of the sensor die.

13 . The sensor package of claim 10 , wherein the sensor die includes a plurality of contact terminals, the plurality of pillar members located between an active region of the sensor die and the plurality of pillar members.

14 . The sensor package of claim 10 , wherein the sensor die is coupled to the substrate in a flip-chip configuration.

15 . The sensor package of claim 10 , wherein the pillar member includes an L-shape.

16 . The sensor package of claim 10 , wherein the substrate includes conductive traces.

17 . The sensor package of claim 10 , further comprising:
a bond wire coupled to the substrate and the sensor die, wherein the encapsulation material encapsulates at least a portion of the bond wire.

18 . A sensor package comprising:
a substrate including a dielectric layer and a conductive trace; a sensor die coupled to the substrate, the sensor die including an active region and a plurality of contact terminals; a transparent member; a plurality of pillar members disposed between and contacting the sensor die and the transparent member, the plurality of pillar members being located between the active region and the plurality of contact terminals; and a bonding material that couples the transparent member to the sensor die, the bonding material contacting a side of a pillar member, of the plurality of pillar members.

19 . The sensor package of claim 18 , further comprising:
a bond wire coupled to the substrate and a contact terminal of the plurality of contact terminals; an encapsulation material that encapsulates the bond wire; and a plurality of conductive members coupled to the substrate.

20 . The sensor package of claim 18 , wherein the bonding material is disposed on a perimeter portion of a mount area of the sensor die, each of the plurality of pillar members located on a separate corner portion of the mount area of the sensor die, the pillar member including a first linear portion and a second linear portion, the second linear portion extending from the first linear portion, the second linear portion being disposed at a non-zero angle with respect to the first linear portion.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Hsieh Yu-Te

Classifications

• H10F39/80373

  characterised by the gate of the transistor · CPC title

• H10F39/809

  of hybrid image sensors · CPC title

• H10F39/806 Primary

  Optical elements or arrangements associated with the image sensors · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H01L27/14634

  Electricity · mapped topic