Image sensor package having a light blocking member

Patent metadata

Field	Value
Publication number	US-12068345-B2
Application number	US-202217816797-A
Country	US
Kind code	B2
Filing date	Aug 2, 2022
Priority date	Mar 28, 2019
Publication date	Aug 20, 2024
Grant date	Aug 20, 2024

Abstract

According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.

First claim

The invention claimed is:

1. A sensor package comprising:
a substrate including an image sensor die, the image sensor die having an active area configured to receive an incoming optical signal;
a transparent layer including a first surface and a second surface, the first surface positioned at an edge of the sensor package and the second surface facing the image sensor die;
at least one dam member that couples a first portion of the second surface of the transparent layer to the image sensor die; and
a light blocking layer that contacts a second portion of the second surface of the transparent layer and that surrounds the active area of the image sensor die, the second portion being adjacent to the first portion, the light blocking layer not contacting the first portion.

2. The sensor package of claim 1 , wherein the light blocking layer includes a non-transparent material configured to coat a portion of the transparent layer.

3. The sensor package of claim 1 , wherein the light blocking layer covers a perimeter of the second surface of the transparent layer.

4. The sensor package of claim 1 , wherein the light blocking layer includes a polymer resin with an electrically conductive material.

5. The sensor package of claim 1 , wherein the at least one dam member is non-transparent.

6. The sensor package of claim 1 , further comprising encapsulation material that extends along edges of the image sensor die and the transparent layer.

7. The sensor package of claim 6 , further comprising:
at least one bond wire connected to the substrate and the image sensor die, wherein the encapsulation material encapsulates the at least one bond wire.

8. A sensor package comprising:
a substrate including an image sensor die, the image sensor die having an active area configured to receive an incoming optical signal;
a transparent layer including a first surface and a second surface, the first surface positioned at an edge of the sensor package and the second surface facing the image sensor die;
a light blocking layer that contacts the second surface of the transparent layer and that surrounds the active area of the image sensor die; and
an encapsulation material that extends along edges of the image sensor die and the transparent layer,
wherein the encapsulation material defines a shape that decreases in height from the edge of the transparent layer to an edge of the sensor package.

9. A method of manufacturing a sensor package comprising:
bonding image sensor dice to a substrate configured to support multiple units of sensors;
connecting bond wires between the image sensor dice and the substrate;
coupling a light blocking layer along a perimeter of a surface of a transparent member;
coupling the transparent member over a given image sensor die of the bonded image sensor dice using at least one dam member, the transparent member being coupled with the surface having the light blocking layer facing the given image sensor die; and
applying encapsulation material to cover the bond wires and encapsulate edges of each image sensor die and corresponding transparent member, including, shaping the encapsulation material to decrease in height from an edge of the transparent member to an edge of the sensor package.

10. The method of claim 9 , wherein the coupling the light blocking layer along the perimeter of a surface of a transparent member includes curing a resin material on the surface of the transparent member using ultra-violet treatment.

11. The method of claim 10 , wherein the coupling the light blocking layer along the perimeter of a surface of a transparent member also includes:
applying a tape on a central portion of the surface;
applying the resin material on the surface of the transparent member after applying the tape; and
removing the tape after applying the resin material.

12. The method of claim 9 , wherein the coupling the light blocking layer along the perimeter of a surface of a transparent member includes applying a metal plating to the surface of the transparent member using a photo mask.

13. The method of claim 9 , wherein the at least one dam member includes a resin material, wherein the method further comprises curing the resin material using ultra-violet treatment.

14. A sensor package comprising:
a substrate including an image sensor die;
a transparent layer including a first surface and a second surface, the first surface positioned at an edge of the sensor package and the second surface facing the image sensor die;
at least one dam member coupling a first portion of the second surface of the transparent layer to the image sensor die; and
a light blocking layer contacting only a second portion of the second surface of the transparent layer, the second portion being adjacent to the first portion.

15. The sensor package of claim 14 , wherein the light blocking layer includes a non-transparent material configured to coat a portion of the transparent layer.

16. The sensor package of claim 14 , wherein the light blocking layer covers a perimeter of the second surface of the transparent layer.

17. The sensor package of claim 14 , wherein the light blocking layer includes a polymer resin with an electrically conductive material.

18. The sensor package of claim 14 , further comprising:
an encapsulation material extending along an edge of the image sensor die and an edge of the transparent layer; and
at least one bond wire connected to the substrate and the image sensor die, wherein the encapsulation material encapsulates the at least one bond wire.

19. The sensor package of claim 18 , wherein the encapsulation material defines a shape that decreases in height from the edge of the transparent layer to an edge of the sensor package.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Hsieh Yu-Te
• Chu I-Lin

Classifications

• H10F77/50

  Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title

• H10F39/011

  Manufacture or treatment of image sensors covered by group H10F39/12 · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H01L31/0203

  Electricity · mapped topic

• H01L27/14683

  Electricity · mapped topic