Power chip package structure

Patent metadata

Field	Value
Publication number	US-2025336878-A1
Application number	US-202418739335-A
Country	US
Kind code	A1
Filing date	Jun 11, 2024
Priority date	Apr 29, 2024
Publication date	Oct 30, 2025
Grant date	—

Abstract

A power chip package structure includes a power chip, a first transmission member, two second transmission members, an encapsulant, and an insulating inorganic member. The first and second transmission members are connected to the power chip. The power chip, the first and second transmission members are embedded in the encapsulant. The encapsulant has a layout surface and a slot recessed in the layout surface, and the first and second transmission members are exposed from the layout surface. The first transmission member and an adjacent one of the two second transmission members are spaced apart from each other through the slot by a separation distance. The insulating inorganic member is fixed in the slot. The first transmission member and the adjacent second transmission member jointly define a creepage path that travels along an outer surface of the insulating inorganic member and that is greater than the separation distance.

First claim

What is claimed is:

1 . A power chip package structure, comprising:
a power chip, comprising:
a chip body including a first surface and an opposing second surface;
a first bonding pad located on the first surface; and
two second bonding pads spaced apart from each other on the second surface;
a first transmission member connected to the first bonding pad, wherein the first transmission member has a first end surface away from the first bonding pad; two second transmission members respectively connected to the two second bonding pads, wherein each of the two second transmission members has a second end surface away from the second bonding pad to which it is connected; an encapsulant encapsulating the power chip, the first transmission member, and the two second transmission members; wherein the encapsulant comprises: a layout surface that exposes the first end surface and the two second end surfaces; and two side end surfaces respectively connected to opposite end edges of the layout surface, wherein the encapsulant comprises a slot recessed into the layout surface, wherein the slot penetrates the two side end surfaces; wherein the first end surface and an adjacent one of the two second end surfaces are separated by the slot along a preset direction and are separated by a separation distance; and an insulating inorganic member fixed within the slot, wherein the insulating inorganic member does not protrude from a slot opening of the slot, wherein the insulating inorganic member is formed with an undulating surface facing the slot opening, and two ends of the undulating surface are respectively adjacent to the two side end surfaces of the encapsulant; wherein a creepage path along the undulating surface is defined between the first end surface and an adjacent said second end surface, which is greater than the separation distance.

2 . The power chip package structure according to claim 1 , wherein the insulating inorganic member has two end surfaces, the two ends of the undulating surface are respectively located on the two end surfaces, and the two end surfaces of the insulating inorganic member are respectively coplanar with the two side end surfaces of the encapsulant.

3 . The power chip package structure according to claim 1 , wherein the undulating surface is formed with a plurality of fins, and free ends of the plurality of fins are coplanar with the layout surface of the encapsulant, wherein the creepage path passes through the plurality of the fins.

4 . The power chip package structure according to claim 1 , wherein the first transmission member is a lead frame or a copper clip, wherein one end of the lead frame has the first end surface, and the other end of the lead frame is connected to the first bonding pad, wherein each of the second transmission members is a metal block, and the two second transmission members are respectively connected to the two second bonding pads.

5 . The power chip package structure according to claim 4 , wherein the lead frame has a bending section connected between the one end and the other end, and the slot extends from the layout surface toward the bending section.

6 . The power chip package structure of claim 1 , wherein the power chip package structure comprises a ceramic plate embedded in the encapsulant, an inner metal layer formed on the ceramic plate, and an extended metal block connected to one end of the inner metal layer, wherein the inner metal layer and the extended metal block are jointly defined as the first transmission member, wherein the extended metal block has the first end surface, and the other end of the inner metal layer is connected to the first bonding pad; wherein each of the two second transmission members is a metal block, and the two second transmission members are respectively connected to the two second bonding pads.

7 . The power chip package structure according to claim 6 , wherein the power chip package structure comprises an outer metal layer, and the inner metal layer and the outer metal layer are respectively sintered and fixed on opposite sides of the ceramic plate, wherein a surface of the outer metal layer away from the inner metal layer is exposed from the encapsulant.

8 . The power chip package structure according to claim 1 , wherein a distance between a slot bottom of the slot and the slot opening is greater than a distance between the second surface of the chip body and the layout surface of the encapsulant.

9 . The power chip package structure according to claim 1 , wherein the power chip package structure comprises an insulating thermally conductive adhesive, and the insulating inorganic member is adhered and fixed in the slot through the insulating thermally conductive adhesive.

10 . The power chip package structure according to claim 1 , wherein the power chip package structure comprises a plurality of conductive pastes, and the first transmission member is sintered and fixed to the first bonding pad through one of the plurality of conductive pastes, each of the two second transmission members is fixed to corresponding one of the two second bonding pads by sintering with one of the plurality of conductive pastes.

11 . The power chip package structure according to claim 1 , wherein a material of the insulating inorganic member is ceramic or glass, wherein the first bonding pad is a drain pad, and the two second bonding pads are respectively a source pad and a gate pad; wherein the creepage path is 105% to 295% of the separation distance.

12 . A power chip package structure, comprising:
a power chip, comprising: a chip body including a first surface and an opposing second surface; a first bonding pad located on the first surface; and two second bonding pads spaced apart from each other on the second surface; a first transmission member connected to the first bonding pad, wherein the first transmission member has a first end surface away from the first bonding pad; two second transmission members respectively connected to the two second bonding pads, wherein each of the two second transmission members has a second end surface away from the second bonding pad to which it is connected; an encapsulant encapsulating the power chip, the first transmission member, and the two second transmission members, wherein the encapsulant comprises: a layout surface that exposes the first end surface and the two second end surfaces; and two side end surfaces respectively connected to opposite end edges of the layout surface, wherein the encapsulant comprises a slot recessed into the layout surface, wherein the slot penetrates the two side end surfaces; wherein the first end surface and adjacent one of the two second end surfaces are separated by the slot along a preset direction and are separated by a separation distance; and an insulating inorganic member fixed within the slot, wherein the insulating inorganic member does not protrude from a slot opening of the slot, wherein two end surfaces of the insulating inorganic member are respectively adjacent to the two side end surfaces of the encapsulant; wherein a creepage path along an outer surface of the insulating inorganic member is defined between the first end surface and an adjacent said second end surface, which is greater than the separation distance.

13 . The power chip package structure according to claim 12 , wherein the slot has a slot bottom and two inner side walls connected to the slot bottom, the insulating inorganic member is fixed to the slot bottom, wherein a gap is formed between the insulating inorganic member and each of the two inner side walls, wherein the creepage path passes

Assignees

• Tong Hsing Electronic Industries Ltd

Inventors

• Chiu Zzu-Chi
• Hsieh Yu-Te
• Chen Yan-Wei
• Chung Chih-Yu
• Kuo Yu-Ju

Classifications

• H10W72/076

  of strap connectors · CPC title

• H10W72/60

  Strap connectors, e.g. thick copper clips for grounding of power devices · CPC title

• H10W72/30

  Die-attach connectors · CPC title

• H10W90/796

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/652

  comprising metals or metalloids, e.g. silver · CPC title