Semiconductor package structure and related methods

Patent metadata

Field	Value
Publication number	US-11037970-B2
Application number	US-201816177697-A
Country	US
Kind code	B2
Filing date	Nov 1, 2018
Priority date	Nov 1, 2018
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

Implementations of semiconductor packages may include: a substrate having a first side and a second side and a die having an active area on a second side of the die. A first side of the die may be coupled to the second side of the substrate. The semiconductor package may also include a glass lid having a first side and a second side. The glass lid may be coupled over a second side of the die. The semiconductor package may include a first and a second molding compound and one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound. The second molding compound may be coupled to the substrate and the around the die and the glass lid.

First claim

What is claimed is:

1. A semiconductor package comprising:
a substrate comprising a first side and a second side;
a die comprising an active area on a second side of the die, a first side of the die coupled to the second side of the substrate;
a glass lid comprising a first side and a second side, the glass lid coupled over a second side of the die;
a first molding compound and a second molding compound forming an interface around the glass lid; and
one or more cushions positioned between a first side of the glass lid and a portion of the first molding compound;
wherein the first molding compound is coupled to the substrate and around the die and the glass lid.

2. The package of claim 1 , further comprising wire bonds electrically coupling the die to the substrate.

3. The package of claim 1 , wherein the die is an image sensor die.

4. The package of claim 1 , wherein the substrate is one of a stripline or a printed circuit board.

5. The package of claim 1 , further comprising a ball grid array on a first side of the substrate.

6. The package of claim 1 , wherein the one or more cushions are comprised of one of epoxy, silicone, acrylic, resin, polyimide, polymer, or any combination thereof.

7. A semiconductor package comprising:
a substrate comprising a first side and a second side;
a die comprising an active area on a second side of the die, a first side of the die coupled to the second side of the substrate;
a glass lid comprising a first side and a second side opposing the first side, the glass lid coupled over a second side of the die;
a first molding compound coupled to the substrate and around a portion of the die, the first molding compound comprising one or more shelves around the die;
a dam positioned on the one or more shelves and the glass lid coupled to the dam; and
a second molding compound coupled with an edge of the first molding compound, the second molding compound coupled over a portion of the second side of the glass lid.

8. The package of claim 7 , further comprising wire bonds electrically coupling the die to the substrate.

9. The package of claim 7 , wherein the die is an image sensor die.

10. The package of claim 7 , wherein the substrate is one of a stripline or a printed circuit board.

11. The package of claim 7 , further comprising a ball grid array on a first side of the substrate.

12. The package of claim 7 , wherein the dam is selected from a group consisting of epoxy, silicone, acrylic, resin, polyimide, polymer, or any combination thereof.

13. A method of forming a semiconductor package, the method comprising:
coupling a first side of a die to a second side of a substrate;
applying a first molding compound to the second side of the substrate and a portion of the first side of the die, wherein the first molding compound comprises a shelf above a second side of the die;
applying a cushion to the shelf;
coupling a first side of a glass lid to the shelf; and
forming a second molding compound on an interface of the first molding compound, the second molding compound coupled around two or more sides of the glass lid and a portion of a second side of the glass lid that opposes the first side.

14. The method of claim 13 , further comprising curing the cushion to form a dam wherein curing comprises one of environmental curing, thermal curing, or ultraviolet curing.

15. The method of claim 13 , wherein the cushion comprises one of epoxy, silicone, acrylic, resin, polyimide, polymer, or any combination thereof.

16. The method of claim 13 , wherein the die is an image sensor comprising an active area on the second side of the die.

17. The method of claim 13 , wherein the substrate is one of a stripline or a printed circuit board.

18. The method of claim 13 , further comprising plasma cleaning the interface of the first molding compound.

19. The method of claim 13 , further comprising electrically coupling the die to the substrate through wire bonds.

20. The method of claim 13 , further comprising applying a ball grid array to a first side of the substrate.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Hsieh Yu-Te

Classifications

• H10F39/811

  Interconnections · CPC title

• H10F39/011

  Manufacture or treatment of image sensors covered by group H10F39/12 · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H01L27/14683

  Electricity · mapped topic

• H01L27/14636

  Electricity · mapped topic