Multi-chip packaging structure for an image sensor

Patent metadata

Field	Value
Publication number	US-2020335544-A1
Application number	US-202016946768-A
Country	US
Kind code	A1
Filing date	Jul 6, 2020
Priority date	Aug 14, 2018
Publication date	Oct 22, 2020
Grant date	—

Abstract

According to an aspect, a multi-chip packaging structure includes a first substrate having a first surface and a second surface, where the first substrate has a conductive layer portion. The multi-chip packaging structure includes an image sensor device coupled to the first surface of the first substrate, a first device coupled to the second surface of the first substrate, and a second substrate disposed apart from the first substrate, where the second substrate has a conductive layer portion. The conductive layer portion of the first substrate is communicatively connected to the conductive layer portion of the second substrate. The first device is disposed between the first substrate and the second substrate. The multi-chip packaging structure includes a second device coupled to the second substrate, and a third device coupled to the first substrate or the second substrate.

First claim

What is claimed is:

1 . An image sensor package comprising:
a first substrate having a first surface and a second surface, the first substrate including conductive traces on the first and second surfaces; an image sensor device coupled to at least one of the conductive traces on the first surface of the first substrate; at least one conductive element coupled to the first substrate and the image sensor device; a first device coupled to at least one of the conductive traces on the second surface of the first substrate; a second substrate having a first surface and a second surface, the second substrate including conductive traces on the first and second surfaces of the second substrate, the first device being disposed between the first substrate and the second substrate; and a conductive via coupled to and between the first substrate and the second substrate.

2 . The image sensor package of claim 1 , further comprising:
an insulation layer disposed between the first substrate and the second substrate.

3 . The image sensor package of claim 2 , wherein the insulation layer includes a polymer-based material.

4 . The image sensor package of claim 2 , wherein the insulation layer includes a first material and a second material, the second material being different than the first material.

5 . The image sensor package of claim 2 , wherein the conductive via extends through the insulation layer.

6 . The image sensor package of claim 1 , wherein the first substrate includes a copper clad laminate (CCL) substrate.

7 . The image sensor package of claim 1 , wherein the second substrate includes a copper clad laminate (CCL) substrate.

8 . The image sensor package of claim 1 , further comprising:
a plurality of conductive components coupled to the conductive traces on the second surface of the second substrate, the plurality of conductive components configured to be connected to an external device.

9 . The image sensor package of claim 8 , wherein the plurality of conductive components includes solder ball members.

10 . The image sensor package of claim 1 , wherein the image sensor device includes a first surface and a second surface, the first surface of the image sensor device including an active region configured to receive light, the second surface of the image sensor device being coupled to at least one of the conductive traces on the first surface of the first substrate, the image sensor package further comprising:
a lid member coupled to the first surface of the image sensor device via a bonding material such that an empty space exists between the active region of the image sensor device and the lid member.

11 . The image sensor package of claim 1 , further comprising:
a molding material encapsulating the at least one conductive element; and a plurality of conductive vias that couple the first device to the first substrate.

12 . An image sensor package comprising:
a first substrate having a first surface and a second surface, the first substrate including conductive traces on the first and second surfaces; an image sensor device coupled to at least one of the conductive traces on the first surface of the first substrate; at least one conductive element coupled to the first substrate and the image sensor device; a second substrate having a first surface and a second surface, the second substrate including conductive traces on the first and second surfaces of the second substrate; a conductive via coupled to and between the first substrate and the second substrate; a first device coupled to at least one of the conductive traces on the first surface of the second substrate; and a second device coupled to at least one of the conductive traces on the first surface of the second substrate.

13 . The image sensor package of claim 12 , wherein the first device is coupled to the first surface of the second substrate with a plurality of conductive bump members.

14 . The image sensor package of claim 12 , further comprising:
an insulation layer disposed between the first substrate and the second substrate, the insulation layer including a polymer-based material, the conductive via extending through the insulation layer.

15 . The image sensor package of claim 12 , further comprising:
a plurality of conductive components coupled to at least one of the conductive traces on the second surface of the second substrate, the plurality of conductive components configured to be connected to an external device.

16 . The image sensor package of claim 12 , wherein the image sensor device includes a first surface and a second surface, the first surface of the image sensor device including an active region configured to receive light, the second surface of the image sensor device being coupled to at least one of the conductive traces on the first surface of the first substrate, the image sensor package further comprising:
a lid member coupled to the first surface of the image sensor device via a bonding material such that an empty space exists between the active region of the image sensor device and the lid member.

17 . A method of fabricating an image sensor package, the method comprising:
coupling a first device and a second device to a first surface of a first substrate, the first substrate including conductive traces on the first surface and a second surface of the first substrate; disposing one or more insulation layers on the first surface of the first substrate and the first and second devices; disposing a second substrate on the one or more insulation layers, the second substrate including conductive traces on first and second surfaces of the second substrate; coupling an image sensor device to the second substrate; and coupling at least one bond wire to the image sensor device and to the second substrate.

18 . The method of claim 17 , further comprising:
forming a conductive via between the first substrate and the second substrate.

19 . A method of fabricating an image sensor package, the method comprising:
disposing at least one insulation layer on a first surface of a first substrate, the first substrate including conductive traces on the first surface and a second surface of the first substrate; disposing a first device on the one or more insulation layers; disposing at least one insulation layer on the first device; coupling a second substrate to the first device, the second substrate including conductive traces on first and second surfaces of the second substrate; coupling an image sensor device to the second substrate; and coupling at least one bond wire to the image sensor device and to the second substrate.

20 . The method of claim 19 , further comprising:
forming a conductive via between the first substrate and the second substrate.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Hsieh Yu-Te

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title