Method for defining a gap height within an image sensor package

Patent metadata

Field	Value
Publication number	US-2022020800-A1
Application number	US-202016948792-A
Country	US
Kind code	A1
Filing date	Oct 1, 2020
Priority date	Jul 15, 2020
Publication date	Jan 20, 2022
Grant date	—

Abstract

According to an aspect, a method for fabricating an image sensor package to define a gap height includes coupling an image sensor die to a substrate, forming a plurality of pillar members on the image sensor die, dispensing a bonding material on the image sensor die, contacting a transparent member with the bonding material such that a height of the pillar members defines a gap height between an active region of the image sensor die and the transparent member, and curing the bonding material to couple the transparent member to the image sensor die.

First claim

What is claimed is:

1 . A method for fabricating an image sensor package to define a gap height, the method comprising:
coupling an image sensor die to a substrate; forming a plurality of pillar members on the image sensor die; dispensing a bonding material on the image sensor die; contacting a transparent member with the bonding material such that a height of the pillar members defines a gap height between an active region of the image sensor die and the transparent member; and curing the bonding material to couple the transparent member to the image sensor die.

2 . The method of claim 1 , wherein the forming the plurality of pillar members on the image sensor die includes:
dispensing a liquid epoxy resin on the image sensor die; curing the liquid epoxy resin to form the plurality of pillar members.

3 . The method of claim 2 , wherein the liquid epoxy resin is cured using ultraviolet (UV) light.

4 . The method of claim 1 , wherein the forming the plurality of pillar members on the image sensor die includes creating conductive members.

5 . The method of claim 1 , wherein the bonding material is dispensed on the pillar members such that the bonding material encompasses the plurality of pillar members.

6 . The method of claim 5 , wherein the bonding material is dispensed on a perimeter portion of a mount area of the image sensor die.

7 . The method of claim 6 , wherein each of the plurality of pillar members is formed on a separate corner portion of the mount area of the image sensor die.

8 . The method of claim 1 , wherein the bonding material includes a liquid epoxy resin, wherein the liquid epoxy resin is cured to form a solid bonding material.

9 . The method of claim 1 , further comprising:
coupling bond wires to the image sensor die and to the substrate before the plurality of pillar members are formed on the image sensor die.

10 . The method of claim 1 , further comprising:
dispensing a molding material on the substrate after the bonding material is cured.

11 . A method for fabricating an image sensor package to define a gap height, the method comprising:
coupling an image sensor die to a substrate; coupling bond wires to the image sensor die and to the substrate; forming a plurality of pillar members on a mount area of the image sensor die, the mount area being disposed outside an active region of the image sensor die; dispensing a bonding material on the mount area of the image sensor die; contacting a transparent member with the bonding material such that a height of the plurality of pillar members defines a gap height between the active region of the image sensor die and the transparent member; and curing the bonding material to couple the transparent member to the image sensor die.

12 . The method of claim 11 , wherein the forming the plurality of pillar members on the mount area of the image sensor die includes:
dispensing a liquid epoxy resin on corner portions of the mount area of the image sensor die; curing the liquid epoxy resin to form the plurality of pillar members.

13 . The method of claim 11 , wherein the forming the plurality of pillar members on the mount area of the image sensor die includes creating a conductive member on a separate corner portion of the mount area of the image sensor die.

14 . The method of claim 11 , wherein a pillar member of the plurality of pillar members includes a first linear portion and a second linear portion, the second linear portion being disposed at a non-zero angle with respect to the first linear portion.

15 . The method of claim 11 , wherein the bonding material is dispensed on a perimeter portion of the mount area of the image sensor die, the bonding material covering the plurality of pillar members.

16 . A method for fabricating an image sensor package to define a gap height, the method comprising:
dispensing a bonding material on a mount area of an image sensor die, the image sensor die being coupled to a substrate; coupling a transparent member to a bond head; moving the bond head to a programmable position to place the transparent member in contact with the bonding material, the programmable position defining a gap height between an active region of the image sensor die and the transparent member; curing the bonding material to couple the transparent member to the image sensor die while the bond head is coupled to the transparent member; and releasing the bond head from the transparent member.

17 . The method of claim 16 , further comprising:
reprogramming, using a controller operably coupled to the bond head, the position to increase the gap height between the active region of the image sensor die and the transparent member.

18 . The method of claim 16 , wherein the bonding material includes a liquid epoxy resin that is cured to form a solid bonding material, the epoxy resin having a viscosity greater than a threshold level.

19 . The method of claim 16 , wherein the coupling the transparent member to the bond head includes activating vacuum suction on the bond head, wherein the releasing the bond head from the transparent member includes deactivating vacuum suction on the bond head.

20 . The method of claim 16 , further comprising:
dispensing a molding material on the substrate after the bond head is released from the transparent member.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Hsieh Yu-Te

Classifications

• H10F39/80373

  characterised by the gate of the transistor · CPC title

• H10F39/809

  of hybrid image sensors · CPC title

• H10F39/806 Primary

  Optical elements or arrangements associated with the image sensors · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H01L27/14614

  Electricity · mapped topic