Method for defining a gap height within an image sensor package

Patent metadata

Field	Value
Publication number	US-12107105-B2
Application number	US-202318487611-A
Country	US
Kind code	B2
Filing date	Oct 16, 2023
Priority date	Jul 15, 2020
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, a light transmitting member, and a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member. A height of the plurality of pillar members defines a gap height between an active region of the image sensor die and the light transmitting member. The image sensor package including a bonding material that couples the light transmitting member to the image sensor. The bonding material contacts a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.

First claim

What is claimed is:

1. An image sensor package comprising:
a substrate;
an image sensor die coupled to the substrate;
a light transmitting member;
a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member, a height of the plurality of pillar members defining a gap height between an active region of the image sensor die and the light transmitting member; and
a bonding material that couples the light transmitting member to the image sensor die, the bonding material contacting a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.

2. The image sensor package of claim 1 , wherein the bonding material is disposed on a perimeter portion of a mount area of the image sensor die.

3. The image sensor package of claim 2 , wherein each of the plurality of pillar members is located on a separate corner portion of the mount area of the image sensor die.

4. The image sensor package of claim 1 , further comprising:
one or more bond wires coupled to the image sensor die and the substrate.

5. The image sensor package of claim 1 , wherein the image sensor die includes a plurality of contact terminals, the plurality of pillar members located between the active region and the plurality of pillar members.

6. The image sensor package of claim 1 , wherein the pillar member includes an L-shape.

7. The image sensor package of claim 1 , wherein the substrate includes conductive traces.

8. The image sensor package of claim 1 , further comprising:
an encapsulation material having a portion that contacts the bonding material.

9. The image sensor package of claim 1 , wherein the pillar member includes a first linear portion and a second linear portion, the second linear portion extending from the first linear portion, the second linear portion being disposed at a non-zero angle with respect to the first linear portion.

10. An image sensor package comprising:
a substrate;
an image sensor die coupled to the substrate;
a light transmitting member;
a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member;
a bonding material that couples the light transmitting member to the image sensor die, the bonding material contacting a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die;
a bond wire coupled to the substrate and the image sensor die; and
an encapsulation material that encapsulates the bond wire.

11. The image sensor package of claim 10 , wherein a height of the plurality of pillar members defining a gap height between an active region of the image sensor die and the light transmitting member.

12. The image sensor package of claim 10 , wherein the bonding material is disposed on a perimeter portion of a mount area of the image sensor die, each of the plurality of pillar members located on a separate corner portion of the mount area of the image sensor die.

13. The image sensor package of claim 10 , wherein the image sensor die includes a plurality of contact terminals, the plurality of pillar members located between an active region of the image sensor die and the plurality of pillar members.

14. The image sensor package of claim 10 , wherein the pillar member includes a first linear portion extending a first direction and a second linear portion extending in a second direction, a height of the pillar member extending in a third direction, wherein the first direction, the second direction, and the third direction are orthogonal to each other.

15. The image sensor package of claim 10 , wherein the pillar member includes an L-shape.

16. The image sensor package of claim 10 , wherein the substrate includes conductive traces.

17. The image sensor package of claim 10 , wherein the encapsulation material includes a portion that contacts the bonding material.

18. An image sensor package comprising:
a substrate;
an image sensor die coupled to the substrate, the image sensor die including an active region and a plurality of contact terminals;
a light transmitting member;
a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member, the plurality of pillar members being located between the active region and the plurality of contact terminals; and
a bonding material that couples the light transmitting member to the image sensor die, the bonding material contacting a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.

19. The image sensor package of claim 18 , further comprising:
a bond wire coupled to the substrate and a contact terminal of the plurality of contact terminals;
an encapsulation material that encapsulates the bond wire; and
a plurality of conductive members coupled to the substrate.

20. The image sensor package of claim 18 , wherein the bonding material is disposed on a perimeter portion of a mount area of the image sensor die, each of the plurality of pillar members located on a separate corner portion of the mount area of the image sensor die, the pillar member including a first linear portion and a second linear portion, the second linear portion extending from the first linear portion, the second linear portion being disposed at a non-zero angle with respect to the first linear portion.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Hsieh Yu-Te

Classifications

• H10F39/80373

  characterised by the gate of the transistor · CPC title

• H10F39/809

  of hybrid image sensors · CPC title

• H10F39/806 Primary

  Optical elements or arrangements associated with the image sensors · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H01L27/14634

  Electricity · mapped topic