Hybrid-bonded ic die having topographic surface features
US-2026099012-A1 · Apr 9, 2026 · US
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Eid Feras patents
Eid Feras is listed as an inventor on 488 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Eid Feras |
| Total patents | 488 |
| First publication | Jun 11, 2015 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Package structures with patterned die backside layer
US-12598989-B2 · Apr 7, 2026 · US
Extended hybrid bonding with a photonic interface
US-2026096472-A1 · Apr 2, 2026 · US
Multi-layer integrated ring resonators and waveguide interconnect stacks
US-2026093070-A1 · Apr 2, 2026 · US
Disaggregation and assembly of photonics integrated circuits using photonic vias
US-2026086308-A1 · Mar 26, 2026 · US
Integrated circuit packages including 3 dimensional die stacks with a die having a sidewall modification
US-2026090454-A1 · Mar 26, 2026 · US
Integrated circuit packages including a high thermal conductivity material coupled to a substrate with microchannels in 3 dimensional die stacks
US-2026090452-A1 · Mar 26, 2026 · US
Integrated circuit packages including a heat spreader having a high thermal conductivity material in 3 dimensional die stacks
US-2026090451-A1 · Mar 26, 2026 · US
Integrated circuit packages including a high thermal conductivity material in 3 dimensional die stacks
US-2026090450-A1 · Mar 26, 2026 · US
Photonic stacks for multi-tier photonic integrated circuit package assemblies
US-2026090470-A1 · Mar 26, 2026 · US
Recent patents
Latest publications not already listed above.
Optical coupling using shifted out-of-plane light propagation
US-2026086307-A1 · Mar 26, 2026 · US
Integrated circuit packages including a structural die coupled to a high thermal conductivity material in 3 dimensional die stacks
US-2026090453-A1 · Mar 26, 2026 · US
Technologies for low-crosstalk multilayer waveguide stacks
US-2026086279-A1 · Mar 26, 2026 · US
Integrated circuit heat spreader including sealant interface material
US-12588499-B2 · Mar 24, 2026 · US
Integration of self-assembly features with photonic circuits
US-2026082917-A1 · Mar 19, 2026 · US
Package architecture for quasi-monolithic chip with backside power
US-12581938-B2 · Mar 17, 2026 · US
Conformal power delivery structures near high-speed signal traces
US-12550768-B2 · Feb 10, 2026 · US
Template structure for quasi-monolithic die architectures
US-12550781-B2 · Feb 10, 2026 · US
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems
US-12542358-B2 · Feb 3, 2026 · US
Quasi-monolithic die architectures
US-12538841-B2 · Jan 27, 2026 · US
Metal matrix composite layers having graded filler content for heat dissipation from integrated circuit devices
US-12532739-B2 · Jan 20, 2026 · US
Porous mesh structures for the thermal management of integrated circuit devices
US-12532740-B2 · Jan 20, 2026 · US
Conformal power delivery structures of 3D stacked die assemblies
US-12519073-B2 · Jan 6, 2026 · US
In situ inductor structure in buildup power planes
US-12520506-B2 · Jan 6, 2026 · US
Cooling of conformal power delivery structures
US-12489032-B2 · Dec 2, 2025 · US
Hybrid backside thermal structures for enhanced ic packages
US-12482779-B2 · Nov 25, 2025 · US
Microelectronic assemblies
US-2025336887-A1 · Oct 30, 2025 · US
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets
US-12456702-B2 · Oct 28, 2025 · US
High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries
US-12438087-B2 · Oct 7, 2025 · US
Technologies for high throughput additive manufacturing for integrated circuit components
US-12431430-B2 · Sep 30, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 487 |
| Eid Feras | 8 |
| Ma Qing | 4 |
| Teh Weng Hong | 3 |
| Lin Kevin | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 208 |
| H10W90/00 | 200 |
| H10W90/701 | 127 |
| H10W70/65 | 126 |
| H10W70/685 | 124 |