Cooling of conformal power delivery structures

Patent metadata

Field	Value
Publication number	US-12489032-B2
Application number	US-202117484384-A
Country	US
Kind code	B2
Filing date	Sep 24, 2021
Priority date	Sep 24, 2021
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

Technologies for cooling conformal power delivery structures are disclosed. In one embodiment, an integrated circuit component has a die with a backside power plane mated to it. A lid of the integrated circuit component is mated with the backside power plane, forming a sealed cavity. The lid has an inlet and an outlet, and a channel is defined in the lid for liquid coolant to flow from the inlet, across the backside power plane, and to the outlet. The liquid coolant directly contacts the backside power plane, efficiently removing heat from the backside power plane.

First claim

The invention claimed is:

1 . An integrated circuit component comprising:
a die; a backside power plane mated with the die; and a lid mated with the backside power plane to create a seal between the lid and the backside power plane, wherein the lid comprises an inlet and an outlet, wherein a channel is defined between the inlet and the outlet for liquid coolant to flow from the inlet, over the backside power plane, and to the outlet, wherein the backside power plane is a conformal power delivery structure, wherein the conformal power delivery structure comprises: a first electrically conductive layer comprising metal, the first electrically conductive layer defining one or more recesses; a second electrically conductive layer comprising metal, the second electrically conductive layer at least partially within the one or more recesses of the first electrically conductive layer and having a lower surface that generally conforms with an upper surface of the first electrically conductive layer; and a dielectric material between the surfaces of the first electrically conductive layer and the second electrically conductive layer that conform with one another.

2 . The integrated circuit component of claim 1 , further comprising an adhesive that adheres the lid to the backside power plane.

3 . The integrated circuit component of claim 1 , wherein the backside power plane comprises a top surface that is substantially flat, wherein the channel is defined between the inlet and the outlet for liquid coolant to flow from the inlet, over the top surface that is substantially flat, and to the outlet.

4 . The integrated circuit component of claim 1 , wherein the backside power plane comprises a first power plane and a second power plane,
wherein the first power plane comprises a first plurality of linear strips oriented perpendicular to a direction of flow of liquid coolant from the inlet to the outlet, wherein the second power plane comprises a second plurality of linear strips oriented parallel to the direction of flow of liquid coolant from the inlet to the outlet, wherein the first power plane is between the die and the second power plane, wherein the channel is defined between the inlet and the outlet for liquid coolant to flow (i) from the inlet, (ii) between a first linear strip and second linear strip of the second plurality of linear strips in a plane defined by the second power plane and above a plane defined by the first power plane, (iii) between a third linear strip and a fourth linear strip of the first plurality of linear strips in a plane defined by the first power plane and below the plane defined by the second power plane, (iv) between the second linear strip and a fifth linear strip of the second plurality of linear strips in the plane defined by the second power plane and above the plane defined by the first power plane, and (v) to the outlet.

5 . The integrated circuit component of claim 1 , wherein the backside power plane comprises a first power plane and a second power plane,
wherein the first power plane comprises a first plurality of linear strips oriented perpendicular to a direction of flow of liquid coolant from the inlet to the outlet, wherein the second power plane comprises a second plurality of linear strips oriented parallel to the direction of flow of liquid coolant from the inlet to the outlet, wherein the first power plane is between the die and the second power plane, wherein individual linear strips of the first plurality of linear strips extend around individual linear strips of the second plurality of linear strips to the die.

6 . The integrated circuit component of claim 1 , wherein the integrated circuit component comprises a processor.

7 . A system comprising:
an integrated circuit component comprising a backside power plane; and means for liquid cooling the backside power plane, wherein the backside power plane is a conformal power delivery structure, wherein the conformal power delivery structure comprises:
a first electrically conductive layer comprising metal, the first electrically conductive layer defining one or more recesses;
a second electrically conductive layer comprising metal, the second electrically conductive layer at least partially within the one or more recesses of the first electrically conductive layer and having a lower surface that generally conforms with an upper surface of the first electrically conductive layer; and
a dielectric material between the surfaces of the first electrically conductive layer and the second electrically conductive layer that conform with one another.

8 . The system of claim 7 , wherein the integrated circuit component comprises:
a die, wherein the backside power plane is mated with the die; and a lid mated with the backside power plane to create a seal between the lid and the backside power plane, wherein the lid comprises an inlet and an outlet, wherein a channel is defined between the inlet and the outlet for liquid coolant to flow from the inlet, over the backside power plane, and to the outlet.

9 . The system of claim 7 , wherein the integrated circuit component comprises:
a die, wherein the backside power plane is mated with the die; and a lid mated with the backside power plane to create a seal between the lid and the backside power plane, wherein the lid comprises an opening that exposes a top surface of the backside power plane, wherein the means for liquid cooling the backside power plane comprises means for immersing the integrated circuit component in liquid coolant.

Assignees

• Intel Corp

Inventors

• Eid Feras
• Aleksov Aleksandar
• Braunisch Henning
• Elsherbini Adel
• Sounart Thomas L
• Swan Johanna

Classifications

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/45

  Liquid fillings · CPC title

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title