Substrate processing apparatus and substrate processing method
US-12027402-B2 · Jul 2, 2024 · US
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Yokoyama Toshio patents
Yokoyama Toshio is listed as an inventor on 48 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yokoyama Toshio |
| Total patents | 48 |
| First publication | Mar 26, 2015 |
| Latest publication | Jul 2, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Substrate processing apparatus
US-12020954-B2 · Jun 25, 2024 · US
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
US-11781233-B2 · Oct 10, 2023 · US
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
US-11767606-B2 · Sep 26, 2023 · US
Plating apparatus
US-11434580-B2 · Sep 6, 2022 · US
Plating apparatus
US-11332838-B2 · May 17, 2022 · US
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
US-2022074065-A1 · Mar 10, 2022 · US
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
US-2022074064-A1 · Mar 10, 2022 · US
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
US-11230780-B2 · Jan 25, 2022 · US
Substrate processing apparatus
US-2021391190-A1 · Dec 16, 2021 · US
Recent patents
Latest publications not already listed above.
Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method
US-11098414-B2 · Aug 24, 2021 · US
Substrate processing apparatus and substrate processing method
US-2021210368-A1 · Jul 8, 2021 · US
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
US-2021180202-A1 · Jun 17, 2021 · US
Substrate processing apparatus
US-11024520-B2 · Jun 1, 2021 · US
Substrate holder and plating apparatus
US-11015261-B2 · May 25, 2021 · US
Plating apparatus
US-2020277709-A1 · Sep 3, 2020 · US
Substrate-holder inspection apparatus, plating apparatus including the same, and appearance inspection apparatus
US-2020255968-A1 · Aug 13, 2020 · US
Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device
US-10665495-B2 · May 26, 2020 · US
Supply-liquid producing apparatus and supply-liquid producing method
US-10654017-B2 · May 19, 2020 · US
Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method
US-2020056301-A1 · Feb 20, 2020 · US
Substrate processing apparatus
US-2020027759-A1 · Jan 23, 2020 · US
Substrate processing apparatus
US-2020027758-A1 · Jan 23, 2020 · US
Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method
US-10501862-B2 · Dec 10, 2019 · US
Substrate processing apparatus
US-10468274-B2 · Nov 5, 2019 · US
Substrate attaching/detaching unit for substrate holder, wet-type substrate processing apparatus including the same, substrate holder conveying method, substrate processing apparatus, and substrate conveying method
US-2019214278-A1 · Jul 11, 2019 · US
Engine including direct injector and port injector
US-10344729-B2 · Jul 9, 2019 · US
Plating apparatus
US-2019093250-A1 · Mar 28, 2019 · US
Substrate holder and plating apparatus
US-2019084777-A1 · Mar 21, 2019 · US
Supply-liquid producing apparatus and supply-liquid producing method
US-2019015801-A1 · Jan 17, 2019 · US
Rinsing bath and substrate cleaning method using such rinsing bath
US-10160013-B2 · Dec 25, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ebara Corp | 44 |
| Mitsubishi Motors Corp | 2 |
| Mitsubishi Motor Eng | 2 |
| Ebara Corp | 2 |
| Yokoyama Toshio | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D17/001 | 20 |
| C25D17/06 | 16 |
| H10P72/7602 | 15 |
| H10P72/3308 | 13 |
| C25D21/12 | 11 |