Substrate holder and plating apparatus

Patent metadata

Field	Value
Publication number	US-11015261-B2
Application number	US-201716084948-A
Country	US
Kind code	B2
Filing date	Mar 7, 2017
Priority date	Mar 22, 2016
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.

First claim

The invention claimed is:

1. A substrate holder comprising:
a substrate holding body for pinching and holding a peripheral edge portion of a substrate; and
a first holding member and a second holding member that interpose and holds the substrate holding body therebetween, wherein
the first holding member includes an opening portion through which a plating target surface of the substrate is exposed, and a power supply member configured so as to be in contact with the plating target surface of the substrate,
the substrate holding body includes a substrate support body for supporting the peripheral edge portion of the substrate, and a fixing member for fixing the substrate supported by the substrate support body to the substrate support body, and
the fixing member is configured to contact a second surface opposite and parallel to the planting target surface.

2. The substrate holder according to claim 1 , wherein the substrate support body has a support surface for supporting the peripheral edge portion of the substrate, and an opening through which the plating target surface of the substrate is exposed, and the fixing member has a fixing portion for fixing the peripheral edge portion of the substrate to the support surface, and a moving portion for moving the fixing portion along the support surface.

3. The substrate holder according to claim 1 , wherein the first holding member has a guide member for guiding a position of the substrate holding body with respect to the first holding member.

4. The substrate holder according to claim 1 , wherein the second holding member has a protruding portion on a surface thereof facing the substrate holding body, and the substrate holding body has a hole in which the protruding portion is inserted.

5. The substrate holder according to claim 1 , wherein the first holding member has an external contact portion that is configured to be electrically connected to an external power supply, and the power supply member is electrically connected to the external contact portion.

6. The substrate holder according to claim 1 , wherein the second holding member has an external contact portion configured to be electrically connected to an external power supply, and a relay contact portion that is configured to be electrically connected to the external contact portion and come into contact with the power supply member of the first holding member.

7. The substrate holder according to claim 1 , wherein the substrate holding body is configured to be capable of holding a polygonal substrate.

8. The substrate holder according to claim 7 , wherein the opening portion has a polygonal shape corresponding to the polygonal substrate, and is formed in the first holding member so that a corner portion thereof is located at a lower side in a vertical direction when the substrate holder is suspended in the vertical direction.

9. The substrate holder according to claim 1 , further comprising a first seal member for sealing a gap between a plating target surface of the substrate held by the substrate holding body and the first holding member, and a second seal member for sealing a gap between the first holding member and the second holding member, wherein the power supply member is configured to be in contact with the plating target surface of the substrate in a sealed space formed by at least the first seal member and the second seal member.

10. A plating apparatus for performing plating processing using the substrate holder according to claim 1 , comprising:
a substrate transporting device for transporting the substrate to the substrate holding body; and a substrate holding body mounting/demounting section for mounting/demounting the substrate holding body holding the substrate to/from the first holding member and the second holding member.

11. The plating apparatus according to claim 10 , further comprising a first stocker for stocking the substrate holding body, and a second stocker for stocking the first holding member and the second holding member.

12. The plating apparatus according to claim 10 , wherein the substrate holding body mounting/demounting section includes a substrate holding body mounting portion for causing the first holding member and the second holding member to hold the substrate holding body, and a substrate holding body demounting portion for demounting the substrate holding body from the first holding member and the second holding member.

Assignees

• Ebara Corp

Inventors

• Mukaiyama Yoshitaka
• Yokoyama Toshio
• Yamakawa Junitsu
• Tsushima Takuya
• Hirao Tomonori
• Tamura Sho
• Ohashi Hirotaka

Classifications

• B65G49/02

  for conveying workpieces through baths of liquid · CPC title

• H10P72/0476

  comprising at least one plating chamber · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• C25D17/007

  Current directing devices · CPC title

• C25D17/06 Primary

  Suspending or supporting devices for articles to be coated · CPC title