Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-2020027758-A1
Application number	US-201916588178-A
Country	US
Kind code	A1
Filing date	Sep 30, 2019
Priority date	Mar 24, 2015
Publication date	Jan 23, 2020
Grant date	—

Abstract

The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.

First claim

1 . A substrate processing apparatus comprising:
a substrate holder for holding a substrate; a processing chamber configured to hold a processing liquid for processing the substrate, the substrate holder being disposed in the processing chamber; a porous member secured to an upper portion of the processing chamber, the porous member having an upper surface and a lower surface, the porous member locating a surface of the processing liquid between the upper surface and the lower surface of the porous member; a liquid delivery pipe having one end coupled to a bottom of the processing chamber and other end located above the porous member; and a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the bottom of the processing chamber through the liquid delivery pipe and to supply the processing liquid onto the porous member through the liquid delivery pipe.

2 . The substrate processing apparatus according to claim 1 , wherein the substrate holder has a flange which closes the through-hole.

3 . A substrate processing apparatus comprising:
a substrate holder for holding a substrate; a processing chamber configured to hold a processing liquid for processing the substrate, the substrate holder being disposed in the processing chamber; processing-liquid nozzles disposed in the processing chamber and oriented to the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the processing chamber and other end coupled to the processing-liquid nozzles; and a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from a bottom of the processing chamber through the liquid delivery pipe and to deliver the processing liquid to the processing-liquid nozzles through the liquid delivery pipe.

4 . The substrate processing apparatus according to claim 3 , further comprising:
a nozzle swing device configured to swing the processing-liquid nozzles.

5 . The substrate processing apparatus according to claim 3 , further comprising:
a holder oscillation device configured to cause the substrate holder to reciprocate vertically.

6 . A substrate processing apparatus comprising:
a substrate holder for holding a substrate; a processing chamber configured to hold a processing liquid for processing the substrate, the substrate holder being disposed in the processing chamber; a liquid delivery pipe having one end coupled to a bottom of the processing chamber and other end communicating with an interior of the processing chamber; a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the bottom of the processing chamber through the liquid delivery pipe and to return the processing liquid into the processing chamber through the liquid delivery pipe; and baffle plates disposed in the inner chamber and arranged adjacent to the substrate held by the substrate holder.

7 . The substrate processing apparatus according to claim 6 , further comprising:
a holder oscillation device configured to cause the substrate holder to oscillate vertically.

8 . The substrate processing apparatus according to claim 6 , further comprising:
a baffle-plate swing device configured to swing the baffle plates.

9 . A substrate processing apparatus comprising:
a substrate holder for holding a substrate; a processing chamber configured to hold a processing liquid for processing the substrate, the substrate holder being disposed in the processing chamber; a liquid delivery pipe having one end coupled to a bottom of the processing chamber and other end communicating with an interior of the processing chamber; a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from a bottom of the processing chamber through the liquid delivery pipe and to return the processing liquid into the processing chamber through the liquid delivery pipe; and a holder oscillation device configured to cause the substrate holder to oscillate vertically, the substrate holder having at least one paddle for agitating the processing liquid.

10 . The substrate processing apparatus according to claim 9 , wherein the at least one paddle comprises paddles arranged at both sides of the substrate held by the substrate holder.

11 . The substrate processing apparatus according to claim 9 , wherein the at least one paddle comprises paddles extending across the substrate held by the substrate holder horizontally.

12 . A substrate processing apparatus comprising:
a substrate holder for holding a substrate; a processing chamber configured to hold a processing liquid for processing the substrate, the substrate holder being disposed in the processing chamber; a liquid delivery pipe having one end coupled to a bottom of the processing chamber and other end communicating with an interior of the processing chamber; a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the bottom of the processing chamber through the liquid delivery pipe and to return the processing liquid into the processing chamber through the liquid delivery pipe; and inert-gas supply nozzles disposed in the processing chamber and oriented to the substrate held by the substrate holder.

13 . A substrate processing apparatus comprising:
a substrate holder for holding a substrate; a processing chamber configured to hold a processing liquid for processing the substrate, the substrate holder being disposed in the processing chamber; a porous member secured to an upper portion of the processing chamber; a liquid delivery pipe having one end coupled to a bottom of the processing chamber and other end located above the porous member; and a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the bottom of the processing chamber through the liquid delivery pipe and to supply the processing liquid onto the porous member through the liquid delivery pipe.

14 . A substrate processing apparatus comprising:
a substrate holder for holding a substrate; a processing chamber configured to hold a processing liquid for processing the substrate, the substrate holder being disposed in the processing chamber; a liquid delivery pipe having one end coupled to a bottom of the processing chamber and other end communicating with an interior of the processing chamber; a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the bottom of the processing chamber through the liquid delivery pipe and to return the processing liquid into the processing chamber through the liquid delivery pipe; and an elastic membrane incorporated in a side wall of the processing chamber, the elastic membrane facing a surface of the substrate held by the substrate holder.

15 . The substrate processing apparatus according to claim 14 , wherein the elastic membrane constitutes at least a part of a fluid chamber which can receive a fluid therein.

Assignees

• Ebara Corp

Inventors

• Kurashina Keiichi
• Yokoyama Toshio

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3308

  Vertical transfer of a single workpiece · CPC title

• H10P72/0426

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0416 Primary

  with the semiconductor substrates being dipped in baths or vessels · CPC title