Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10468274-B2
Application number	US-201615076265-A
Country	US
Kind code	B2
Filing date	Mar 21, 2016
Priority date	Mar 24, 2015
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a substrate holder for holding a substrate, the substrate holder having two holding arms;
a processing chamber including an outer chamber configured to hold a processing liquid for processing the substrate, and an inner chamber housed in the outer chamber and capable of surrounding the substrate held by the substrate holder;
a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber;
a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and
a guide cover having a through-hole in which the substrate holder can be inserted, the guide cover being located below an upper end of the outer chamber and above the inner chamber, the guide cover being arranged to change a direction of an ascending flow formed in the outer chamber, the guide cover being secured to an inner surface of the outer chamber and guiding the processing liquid impinged on a lower surface of the guide cover into the inner chamber,
the substrate holder having a flange which closes the through-hole, and
the flange being secured to the two holding arms, the flange having a size smaller than the outer chamber and larger than the through-hole.

2. The substrate processing apparatus according to claim 1 , wherein the guide cover has a lower surface on which the processing liquid impinges.

3. The substrate processing apparatus according to claim 1 , wherein the guide cover extends parallel to the flange.

Assignees

• Ebara Corp

Inventors

• Kurashina Keiichi
• Yokoyama Toshio

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3308

  Vertical transfer of a single workpiece · CPC title

• H10P72/0426

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0416 Primary

  with the semiconductor substrates being dipped in baths or vessels · CPC title