Plating apparatus

Patent metadata

Field	Value
Publication number	US-11434580-B2
Application number	US-202016796782-A
Country	US
Kind code	B2
Filing date	Feb 20, 2020
Priority date	Feb 28, 2019
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.

First claim

What is claimed is:

1. A plating apparatus for performing a plating process on a substrate held onto a substrate holder, the plating apparatus comprising:
a plating tank configured to receive the substrate holder holding the substrate; and
a block mechanism for reducing a diversion of an electric field into a region between a side surface of the substrate holder and an inner surface of the plating tank,
the block mechanism comprising:
a guiding member fixed on the inner surface of the plating tank and extending to an inside of the plating tank from the inner surface of the plating tank;
a seal block supported by the guiding member; and
a moving mechanism configured to move the seal block toward the substrate holder disposed inside the plating tank.

2. The plating apparatus according to claim 1 , wherein
the moving mechanism is configured to move the seal block toward a side surface of the substrate holder disposed inside the plating tank.

3. The plating apparatus according to claim 1 , wherein
the moving mechanism is configured to move the seal block toward a front surface of the substrate holder disposed inside the plating tank.

4. The plating apparatus according to claim 1 , wherein
the moving mechanism is configured to move the seal block toward a back surface of the substrate holder disposed inside the plating tank.

5. The plating apparatus according to claim 1 , wherein
the seal block includes a sealing member contactable to the substrate holder disposed inside the plating tank.

6. The plating apparatus according to claim 1 , wherein
the seal block extends in a height direction of the plating tank.

7. The plating apparatus according to claim 1 , wherein
the seal block extends along a side surface and a bottom surface inside the plating tank.

8. The plating apparatus according to claim 1 , wherein
the moving mechanism includes a fluid spring.

9. The plating apparatus according to claim 1 , wherein
the moving mechanism includes a cam element.

10. The plating apparatus according to claim 1 , wherein
the guiding member comprises: a pair of guiding member, each of which is disposed at opposing side inner surface of the plating tank.

11. The plating apparatus according to claim 1 , wherein
the guiding member comprises two opposed plate-shaped members, and the seal block is disposed between the two opposed plate-shaped members.

Assignees

• Ebara Corp

Inventors

• Hirao Tomonori
• Yamasaki Gaku
• Abe Takahiro
• Yokoyama Toshio

Classifications

• C25D17/004 Primary

  Sealing devices · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• H05K3/241

  characterised by the electroplating method; means therefor, e.g. baths or apparatus · CPC title

• C25D17/02

  Tanks; Installations therefor · CPC title