Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method

Patent metadata

Field	Value
Publication number	US-10501862-B2
Application number	US-201715669735-A
Country	US
Kind code	B2
Filing date	Aug 4, 2017
Priority date	Aug 8, 2016
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.

First claim

What is claimed is:

1. A plating system comprising:
a plating tank for applying plate processing to a substrate;
a sensor configured to measure actual plating film thickness of the substrate;
a controller configured to control plating current and plating time for the plate processing of the substrate within the plating tank;
wherein the controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe; in accordance with the actual plating film thickness and the target plating film thickness, at least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and at least one of the corrected plating current and the corrected plating time is reflected in the plate processing for the subsequent substrate;
wherein the controller corrects the plating current without correcting the plating time when plating current density corresponding to the corrected plating current is between first current density and second current density, inclusive; and
wherein when the plating current density is lower than the first current density or higher than the second current density, the controller corrects the plating current to correct first film thickness difference of measured film thickness difference between the target plating film thickness and the actual plating film thickness, and corrects the plating time to correct second film thickness difference that is difference between the measured film thickness difference and the first film thickness difference.

2. The plating system according to claim 1 ,
wherein the first film thickness difference is a film thickness correction amount that is corrected by the first current density or the second current density of the plating current density; and
wherein the second film thickness difference is difference between the film thickness correction amount corrected by the first current density or the second current density and the measured film thickness difference.

3. The plating system according to claim 2 ,
wherein the controller calculates a correction amount of the plating current on the basis of the actual plating film thickness;
wherein when the correction amount of the plating current is equal to or higher than a first current correction amount corresponding to the first current density and equal to or lower than a second current correction amount corresponding to the second current density, the controller calculates the corrected plating current from the correction amount of the plating current; and
wherein when the correction amount of the plating current is lower than the first current correction amount or higher than the second current correction amount, the controller sets the correction amount of the plating current to the first current correction amount or the second current correction amount, and calculates the correction amount of the plating time so as to further correct the difference between the film thickness correction amount corresponding to the first current correction amount or the second current correction amount and the measured film thickness difference.

4. The plating system according to claim 1 ,
wherein the controller corrects the plating current without correcting the plating time.

5. The plating system according to claim 1 ,
wherein the controller corrects the plating time without correcting the plating current.

6. The plating system according to claim 1 ,
wherein the controller applies statistical processing to the actual plating film thickness of the plurality of substrates, the target plating film thickness, and theoretical plating time for obtaining the target plating film thickness; and when the number of data acquired by the statistical processing exceeds a predetermined value, the controller corrects at least one of the plating current and the plating time by using the data acquired by the statistical processing.

7. The plating system according to claim 1 ,
wherein the plating tank includes a plurality of plating cells; and
wherein the actual plating film thickness of the substrate subjected to the plate processing in each of the plating cells is measured, and at least one of the plating current and the plating time is corrected with respect to each of the plating cells in accordance with the actual plating film thickness.

8. The plating system according to claim 1 ,
wherein there is further provided an aligner configured to align the substrate; and
wherein the sensor is disposed in the aligner.

9. The plating system according to claim 1 ,
wherein there is provided a substrate attachment/detachment section for attaching the substrate to a substrate holder;
wherein the sensor is disposed in the substrate attachment/detachment section.

10. A plating system comprising:
a plating tank for applying plate processing to a substrate;
a sensor configured to measure actual plating film thickness of the substrate;
a controller configured to control plating current and plating time for the plate processing of the substrate within the plating tank;
wherein the controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe; in accordance with the actual plating film thickness and the target plating film thickness, at least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and at least one of the corrected plating current and the corrected plating time is reflected in the plate processing for the subsequent substrate;
wherein the controller is configured to be set so that the plate processing is carried out on the substrate in a plurality of steps, have or obtain the plating current and the plating time, which are set with respect to each step, as the recipe, and correct the plating current and/or the plating time in each step;
wherein when the plating current is corrected, the correction amount of the plating current is corrected by adding the correction amount to a value of the plating current; and the correction amount is set to a value common to the steps;
wherein the controller is further capable of setting an aperture ratio that is a fraction obtained by dividing actual plating area by area of the substrate, or the actual plating area, as a preset recipe item;
wherein by using the following Expressions 1 and 2,

T
R

=

a
+

bT
T

+

c
⁢

⁢

γ

ρ
⁢

⁢
A

⁢

t
T

Assignees

• Ebara Corp

Inventors

• Mitsuya Takashi
• Koizumi Ryuya
• Yokoyama Toshio
• Shimoyama Masashi
• Oishi Kunio

Classifications

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10W72/0112

  Apparatus for manufacturing bump connectors · CPC title

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W20/023

  the interconnections being through-semiconductor vias · CPC title

• H10W20/063

  by forming conductive members before forming protective insulating material · CPC title