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Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
US11230780B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11230780-B2 |
| Application number | US-201917268036-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2019 |
| Priority date | Aug 22, 2018 |
| Publication date | Jan 25, 2022 |
| Grant date | Jan 25, 2022 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
First claim
Opening claim text (preview).
The invention claimed is: 1. A copper oxide solid to be supplied into a plating solution for plating a substrate, comprising: a copper oxide powder; and a liquid as a binder to bind the copper oxide powder, the liquid comprising the plating solution to which no additives have been added. 2. The copper oxide solid according to claim 1 , wherein the copper oxide solid comprises: an outer portion comprising a surface of the copper oxide solid; and an inner portion located inside the outer portion, and a water content of the outer portion is larger than a water content of the inner portion. 3. The copper oxide solid according to claim 1 , wherein a surface of the copper oxide solid has a concavo-convex shape.
Assignees
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Classifications
Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title
Agitating of electrolytes; Moving of racks · CPC title
Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title
- C25D3/38Primary
of copper · CPC title
Semiconductors · CPC title
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Frequently asked questions
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- What does patent US11230780B2 cover?
- The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied in…
- Who is the assignee on this patent?
- Ebara Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D3/38. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 25 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).