Electric actuator
US-2017211671-A1 · Jul 27, 2017 · US
Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
US11767606B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11767606-B2 |
| Application number | US-202117529769-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 18, 2021 |
| Priority date | Aug 22, 2018 |
| Publication date | Sep 26, 2023 |
| Grant date | Sep 26, 2023 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of producing a copper oxide solid to be supplied into a plating solution for plating a substrate, comprising: an addition step of adding a liquid to a copper oxide powder, the liquid comprising the plating solution to which no additives have been added; and a compression molding step of compression-molding the copper oxide powder with the liquid added. 2. The method according to claim 1 , further comprising: a first compression molding step of compression-molding the copper oxide powder with a first compressive force, the first compression molding step being performed before the addition step, and wherein the compression molding step of compression-molding the copper oxide powder after the addition step is a second compression molding step of compression-molding the copper oxide powder with a second compressive force. 3. The method according to claim 1 , wherein the compression molding step is performed using a press mold having a concavo-convex shape.
Assignees
Inventors
Classifications
- C25D3/38Primary
of copper · CPC title
Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title
Semiconductors · CPC title
Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title
- C25D21/14Primary
Controlled addition of electrolyte components · CPC title
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- What does patent US11767606B2 cover?
- The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied in…
- Who is the assignee on this patent?
- Ebara Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D3/38. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Sep 26 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).