Rinsing bath and substrate cleaning method using such rinsing bath

Patent metadata

Field	Value
Publication number	US-10160013-B2
Application number	US-201514834019-A
Country	US
Kind code	B2
Filing date	Aug 24, 2015
Priority date	Sep 1, 2014
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A rinsing bath which can simplify a discharging structure of a rinsing liquid is disclosed. The rinsing bath includes an inner bath for storing the rinsing liquid, an overflow bath configured to receive the rinsing liquid overflowing the inner bath, a stopper for closing a drain hole provided on a bottom of the inner bath, an actuator configured to move the stopper between a closing position in which the stopper closes the drain hole and a opening position in which the stopper is away from the drain hole, a rinsing liquid supply pipe configured to supply the rinsing liquid into the inner bath, and a drain pipe coupled to a bottom of the overflow bath. The drain hole communicates between an inside of the inner bath and an inside of the overflow bath.

First claim

What is claimed is:

1. A rinsing bath for substrate processing comprising:
an inner bath for holding a rinsing liquid therein;
an overflow bath surrounding the inner bath and configured to receive the rinsing liquid that has overflowed the inner bath;
a stopper disposed in the inner bath and configured to directly close a drain hole provided in a bottom of the inner bath, the drain hole providing a fluid communication between an inside of the inner bath and an inside of the overflow bath;
an actuator configured to move the stopper between a closing position at which the stopper closes the drain hole and an opening position at which the stopper is away from the drain hole, wherein the actuator is disposed above the inner bath;
a rinsing liquid supply pipe configured to supply the rinsing liquid into the inner bath; and
a drain pipe coupled to a bottom of the overflow bath,
wherein the entirety of the inner bath is located in the overflow bath, and
wherein the inner bath is configured to immerse a substrate.

2. The rinsing bath according to claim 1 , further comprising:
a flow rate controller configured to change a flow rate of the rinsing liquid flowing through the rinsing liquid supply pipe.

3. The rinsing bath according to claim 2 , further comprising:
a level detector configured to detect a level of the rinsing liquid in the inner bath,
wherein the flow rate controller is configured to allow the rinsing liquid to flow through the rinsing liquid supply pipe at a first flow rate until the level of the rinsing liquid reaches a predetermined level, and limit the flow rate of the rinsing liquid, flowing through the rinsing liquid supply pipe, to a second flow rate which is lower than the first flow rate, after the level of the rinsing liquid reaches the predetermined level.

4. The rinsing bath according to claim 2 , wherein the flow rate controller comprises an on-off valve attached to the rinsing liquid supply pipe and a bypass pipe which bypasses the on-off valve.

5. The rinsing bath according to claim 1 , wherein the rinsing liquid supply pipe is in a wall of the inner bath.

6. The rinsing bath according to claim 1 , wherein the rinsing liquid supply pipe is in a bottom wall of the inner bath.

7. The rinsing bath according to claim 1 , wherein an upper wall of the inner bath is lower than an upper wall of the overflow bath.

8. The rinsing bath according to claim 1 , further comprising:
a rod extending inside the inner bath, and coupled to the actuator above the inner bath and secured to the stopper in the inner bath, and
wherein the actuator connects to a top of the drain hole inside of the inner bath through the rod and the stopper.

Assignees

• Ebara Corp

Inventors

• Sekimoto Masahiko
• Yokoyama Toshio
• Kobayashi Kenichi
• Akazawa Kenichi

Classifications

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• B08B3/048 Primary

  Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed · CPC title

• H01L21/67057

  Electricity · mapped topic