Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-11024520-B2
Application number	US-201916588178-A
Country	US
Kind code	B2
Filing date	Sep 30, 2019
Priority date	Mar 24, 2015
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a substrate holder for holding a substrate;
a processing chamber configured to hold a processing liquid for processing the substrate, the substrate holder being disposed in the processing chamber;
a porous member secured to an upper portion of the processing chamber, the porous member having an upper surface and a lower surface, the porous member locating a surface of the processing liquid between the upper surface and the lower surface of the porous member;
a liquid delivery pipe having one end coupled to a bottom of the processing chamber and other end located above the porous member; and
a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the bottom of the processing chamber through the liquid delivery pipe and to supply the processing liquid onto the porous member through the liquid delivery pipe,
wherein the pump supplies the processing liquid onto the porous member until the surface of the processing liquid is located between the upper surface and the lower surface of the porous member.

2. The substrate processing apparatus according to claim 1 , wherein the porous member has a hole to pass the substrate holder.

3. The substrate processing apparatus according to claim 1 , wherein the other end of the liquid delivery pipe is branched on both sides of the substrate held by the substrate holder.

Assignees

• Ebara Corp

Inventors

• Kurashina Keiichi
• Yokoyama Toshio

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3308

  Vertical transfer of a single workpiece · CPC title

• H10P72/0426

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0416 Primary

  with the semiconductor substrates being dipped in baths or vessels · CPC title