Plating apparatus

Patent metadata

Field	Value
Publication number	US-11332838-B2
Application number	US-201816129227-A
Country	US
Kind code	B2
Filing date	Sep 12, 2018
Priority date	Sep 22, 2017
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

A plating apparatus including a plating bath, a substrate holder to be arranged in the plating bath and adapted to hold a substrate, an anode for generating an electric field between the substrate and the anode, and at least one electric field shielding body for shielding the substrate holder and a part or the whole of the electric field, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other.

First claim

What is claimed is:

1. A plating apparatus comprising:
a plating bath;
a substrate holder to be arranged in the plating bath and adapted to hold a substrate;
an anode arranged so as to face the substrate holder, the anode including an anode electrode and an anode holder for holding the anode electrode such that the anode electrode is exposed from a rectangular first opening portion provided in the anode holder; and
at least one electric field shielding body for shielding a part of an electric field from the anode electrode to the substrate, wherein the at least one electric field shielding body has a second opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the second opening portion and an opening size in a second direction of the second opening portion independently of each other,
wherein the at least one electric field shielding body includes one or more first shielding members and one or more second shielding members, the one or more first shielding members being arranged on at least one side of first and second end portions in the first direction of the second opening portion, the one or more second shielding members being arranged on at least one side of third and fourth end portions in the second direction of the second opening portion, and
the at least one electric field shielding body has one of the one or more first shielding members arranged on the side of the first end portion in the first direction of the second opening portion, a first link member rotatably connected to the one of the one or more first shielding members by a pin forms a first link mechanism together with the one of the one or more first shielding members, and the one of the one or more first shielding members is translated by rotation of the first link member around an axis perpendicular to the exposed surface of the anode electrode.

2. The plating apparatus according to claim 1 , wherein the one or more first shielding members comprise two first shielding members arranged on both sides of the first and second end portions in the first direction of the second opening portion, and the two first shielding members at the respective end portions are movable in opposite directions.

3. The plating apparatus according to claim 1 , wherein the one or more first shielding members comprise two first shielding members arranged on both sides of the first and second end portions in the first direction of the second opening portion, and the two first shielding members at the respective end portions are movable by the same amount.

4. The plating apparatus according to claim 1 , wherein the one or more first shielding members comprise two first shielding members arranged on both sides of the first and second end portions in the first direction of the second opening portion, and the two first shielding members at the respective end portions are movable by independent driving sources, respectively.

5. The plating apparatus according to claim 1 , wherein the one or more second shielding members is moved by a feed screw mechanism.

6. The plating apparatus according to claim 1 , wherein the one or more second shielding members is moved by a rack and pinion mechanism.

7. The plating apparatus according to claim 1 , wherein the at least one electric field shielding body further includes a base, one end of the one of the one or more first shielding members arranged on the side of the first end portion is rotatably connected to the first link member, the other end of the one of the at least one first shielding members is rotatably connected to a second link member which is rotatably connected to the base, the second link member forms a second link mechanism together with the at least one of the one or more first shielding members, and at least one of the one or more the first shielding members is translated by rotation of the first link member and the second link member, wherein the base is the anode holder or a component separate from the anode holder.

8. The plating apparatus according to claim 1 , wherein the at least one electric field shielding body further includes a base, elongated holes are formed in each of the one or more second shielding members arranged respectively on the sides of the third and fourth end portions in the second direction of the second opening portion, two pins formed in a third link member which is rotatably connected to the base are inserted into the elongated holes of each of the one or more second shielding members, and the one or more second shielding member arranged on a side of the third end portion in the second direction of the second opening portion and the one or more second shielding member arranged on a side of the fourth end portion in the second direction of the second opening portion are moved in opposite directions by rotation of the third link member, wherein the base is the anode holder or a component separate from the anode holder.

9. The plating apparatus according to claim 1 , wherein the at least one electric field shielding body includes a base, the one or more second shielding members arranged on a side of the third end portion in the second direction of the second opening portion, a guide groove fixed with respect to the base, and a guide pin fixed with respect to the one or more second shielding members, and the guide pin moves along the guide groove, whereby the one or more first shielding members are guided.

10. The plating apparatus according to claim 1 , wherein the at least one electric field shielding body includes a base, the one or more second shielding members arranged on a side of the third end portion in the second direction of the second opening portion, a guide pin fixed with respect to the base, and a guide groove fixed with respect to the one or more second shielding members, and the guide pin moves along the guide groove, whereby the one or more first shielding members are guided.

11. The plating apparatus according to claim 1 , wherein the at least one electric field shielding body has a first electric field shielding body provided integrally with the anode holder.

12. The plating apparatus according to claim 1 , wherein the at least one electric field shielding body has a second electric field shielding body provided separately from the anode holder.

13. The plating apparatus according to claim 1 , wherein the one or more first shielding members and/or the one or more second shielding members are driven by power from a motor, a solenoid, or an air cylinder.

14. The plating apparatus according to claim 1 , wherein the second opening portion is rectangular.

15. The plating apparatus according to claim 1 , wherein
the at least one electric field shielding body includes a first electric field shielding body and a second electric field shielding body arranged to be nearer to the substrate than the first electric field shielding body,
the first electric field shielding body is provided integrally with the anode holder, and
the second electric field shielding body is provided separately from the anode holder, and arranged between the substrate holder and the anode holder.

16. The plating apparatus according to claim 15 , wherein the second opening portion comprises an opening area in the first electric field shielding body and an opening area in the second electric field shielding body, wherein an exposed area of the plating target surface of the substrate held by the substrate holder is larger than the opening area of the second electric fi

Assignees

• Ebara Corp

Inventors

• Yamasaki Gaku
• Hirao Tomonori
• Yokoyama Toshio

Classifications

• C25D17/008 Primary

  Current shielding devices · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D17/08

  Supporting} racks {, i.e. not for suspending · CPC title

• C25D5/10 Primary

  Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title