Method for forming a semiconductor device
US-2026096100-A1 · Apr 2, 2026 · US
Xiang Wang is listed as an inventor on 36 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Xiang Wang |
| Total patents | 36 |
| First publication | Apr 26, 2016 |
| Latest publication | Apr 2, 2026 |
Publications ranked by popularity score, then publication date.
US-2026096100-A1 · Apr 2, 2026 · US
US-12532476-B2 · Jan 20, 2026 · US
US-12156487-B2 · Nov 26, 2024 · US
US-2024315017-A1 · Sep 19, 2024 · US
US-2024292765-A1 · Aug 29, 2024 · US
US-12010931-B2 · Jun 11, 2024 · US
US-2024155843-A1 · May 9, 2024 · US
US-2024057488-A1 · Feb 15, 2024 · US
US-11444095-B2 · Sep 13, 2022 · US
US-2022246845-A1 · Aug 4, 2022 · US
Latest publications not already listed above.
US-11387337-B2 · Jul 12, 2022 · US
US-11127752-B2 · Sep 21, 2021 · US
US-2021265376-A1 · Aug 26, 2021 · US
US-2021233924-A1 · Jul 29, 2021 · US
US-11011535-B1 · May 18, 2021 · US
US-2021119004-A1 · Apr 22, 2021 · US
US-10916634-B2 · Feb 9, 2021 · US
US-10903326-B2 · Jan 26, 2021 · US
US-2020373164-A1 · Nov 26, 2020 · US
US-2020227531-A1 · Jul 16, 2020 · US
US-10699958-B2 · Jun 30, 2020 · US
US-10692875-B2 · Jun 23, 2020 · US
US-2020119027-A1 · Apr 16, 2020 · US
US-2020043791-A1 · Feb 6, 2020 · US
US-10312249-B2 · Jun 4, 2019 · US
US-2019139971-A1 · May 9, 2019 · US
US-10121869-B2 · Nov 6, 2018 · US
US-10062705-B1 · Aug 28, 2018 · US
US-9978758-B1 · May 22, 2018 · US
US-2018108744-A1 · Apr 19, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| United Microelectronics Corp | 36 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D30/696 | 22 |
| H10D64/037 | 19 |
| H10B43/30 | 18 |
| H10B43/40 | 15 |
| H10D30/69 | 12 |