Memory devices having signal routing structures at bonding interfaces
US-2024404976-A1 · Dec 5, 2024 · US
characterised by the peripheral circuit region
characterised by the peripheral circuit region · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10B43/40 |
| Official title | characterised by the peripheral circuit region |
| Display label | characterised by the peripheral circuit region |
| Total patents | 9,179 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 248 |
| 2016 | 366 |
| 2017 | 413 |
| 2018 | 460 |
| 2019 | 695 |
| 2020 | 1,041 |
| 2021 | 1,182 |
| 2022 | 1,157 |
| 2023 | 1,103 |
| 2024 | 1,192 |
| 2025 | 1,057 |
| 2026 | 265 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and manufacturing method thereof
US-2024404870-A1 · Dec 5, 2024 · US
Semiconductor memory device and manufacturing method of semiconductor memory device
US-12144179-B2 · Nov 12, 2024 · US
Semiconductor memory device
US-2024315058-A1 · Sep 19, 2024 · US
Methods for forming contact structures and semiconductor devices thereof
US-2024282673-A1 · Aug 22, 2024 · US
Method for fabricating three-dimensional semiconductor device using buried stop layer in substrate
US-2024268119-A1 · Aug 8, 2024 · US
Integrated Assemblies Having Conductive Posts Extending Through Stacks of Alternating Materials
US-2024237336-A9 · Jul 11, 2024 · US
Semiconductor integrated circuit device including split selection lines and method of manufacturing the semiconductor integrated circuit device
US-2024196613-A1 · Jun 13, 2024 · US
Semiconductor memory device and manufacturing method of the semiconductor memory device
US-2024172440-A1 · May 23, 2024 · US
Memory system, semiconductor device and fabrication method therefor
US-2024107759-A1 · Mar 28, 2024 · US
Vertical type non-volatile memory devices and methods of fabricating the same
US-2024074173-A1 · Feb 29, 2024 · US
Non-volatile memory device
US-2024055469-A1 · Feb 15, 2024 · US
Three-dimensional semiconductor memory device, electronic system including the same
US-2024040791-A1 · Feb 1, 2024 · US
Semiconductor device and method of manufacturing the same
US-2015371944-A1 · Dec 24, 2015 · US
Semiconductor device
US-9214409-B2 · Dec 15, 2015 · US
Method of manufacturing semiconductor device and semiconductor device
US-2015333139-A1 · Nov 19, 2015 · US
Semiconductor device and manufacturing method thereof
US-9190333-B2 · Nov 17, 2015 · US
Semiconductor structure and manufacturing method for the same
US-9184096-B2 · Nov 10, 2015 · US
Dense arrays and charge storage devices
US-9171857-B2 · Oct 27, 2015 · US
Semiconductor device and manufacturing method thereof
US-2015303143-A1 · Oct 22, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10B43/40?
- CPC H10B43/40 is the Cooperative Patent Classification code for “characterised by the peripheral circuit region.”
- How many patents are filed under CPC H10B43/40 (characterised by the peripheral circuit region)?
- Our database includes 9,179 publications tagged with this CPC code.
- Is patent activity under CPC H10B43/40 growing?
- Publication counts under this code: 1,192 in 2024 vs 1,057 in 2025 (latest complete years).