Three-dimensional memory devices and fabricating methods thereof
US-12597468-B2 · Apr 7, 2026 · US
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Xia Zhiliang patents
Xia Zhiliang is listed as an inventor on 497 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Xia Zhiliang |
| Total patents | 497 |
| First publication | Jan 10, 2019 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Three-dimensional memory devices and methods for forming the same
US-12598748-B2 · Apr 7, 2026 · US
Semiconductor devices and fabrication methods thereof
US-2026096097-A1 · Apr 2, 2026 · US
Three-dimensional memory devices
US-2026096099-A1 · Apr 2, 2026 · US
Memory programming method, memory device, and memory system
US-12591363-B2 · Mar 31, 2026 · US
Control gate structures in three-dimensional memory devices and methods for forming the same
US-12593445-B2 · Mar 31, 2026 · US
Three-dimensional nand memory device and method of forming the same
US-2026089963-A1 · Mar 26, 2026 · US
Memory device, fabrication method and memory system
US-2026089929-A1 · Mar 26, 2026 · US
Methods for forming contact structures and semiconductor devices thereof
US-2026090351-A1 · Mar 26, 2026 · US
Three-dimensional memory device, manufacturing method thereof, and memory system
US-2026089962-A1 · Mar 26, 2026 · US
Recent patents
Latest publications not already listed above.
Memory system, semiconductor device and fabrication method therefor
US-2026082563-A1 · Mar 19, 2026 · US
Three-dimensional memories and fabrication methods thereof
US-2026082553-A1 · Mar 19, 2026 · US
Vertical memory devices and method of fabrication thereof
US-2026068625-A1 · Mar 5, 2026 · US
Three-dimensional memory and fabrication method for the same
US-12557279-B2 · Feb 17, 2026 · US
Three-dimensional memory devices and fabricating methods thereof
US-12557299-B2 · Feb 17, 2026 · US
Memory device and method of forming the same
US-12557276-B2 · Feb 17, 2026 · US
Three-dimensional memory devices and methods for forming the same
US-2026047095-A1 · Feb 12, 2026 · US
Vertical memory devices
US-12550329-B2 · Feb 10, 2026 · US
Three-dimensional memory devices having semiconductor assemblies bonded by bonding layer and methods for forming the same
US-2026040587-A1 · Feb 5, 2026 · US
Three-dimensional memory devices and fabricating methods thereof
US-12543310-B2 · Feb 3, 2026 · US
Memory devices having vertical transistors and methods for forming the same
US-2026026010-A1 · Jan 22, 2026 · US
Semiconductor devices with stacked structures
US-2026024557-A1 · Jan 22, 2026 · US
Three-dimensional memory devices and methods for forming the same
US-12525558-B2 · Jan 13, 2026 · US
Three-dimensional memory devices
US-12526996-B2 · Jan 13, 2026 · US
Three-dimensional memory device and fabrication method thereof
US-12526999-B2 · Jan 13, 2026 · US
Memory devices and methods for forming the same
US-12520486-B2 · Jan 6, 2026 · US
Three-dimensional memory device, manufacturing method thereof, and memory system
US-12520494-B2 · Jan 6, 2026 · US
Semiconductor device including a memory stack and a contact structure in a spacer structure
US-12519038-B2 · Jan 6, 2026 · US
Three-dimensional memory device and fabrication method for improved yield and reliability
US-12520488-B2 · Jan 6, 2026 · US
Three-dimensional memory device and method of forming the same
US-12513905-B2 · Dec 30, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Yangtze Memory Tech Co Ltd | 497 |
| Yangtze Memory Tech Co ˜Ltd | 1 |
| Yangize Memory Tech Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.