Methods and apparatus for integrating carbon nanofiber into semiconductor devices using W2W fusion bonding
US-12588502-B2 · Mar 24, 2026 · US
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Street Bret K patents
Street Bret K is listed as an inventor on 91 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Street Bret K |
| Total patents | 91 |
| First publication | Dec 24, 2015 |
| Latest publication | Mar 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Monolithic conductive cylinder in a semiconductor device and associated methods
US-2026082886-A1 · Mar 19, 2026 · US
Methods for fusion bonding semiconductor devices to temporary carrier wafers with cavity regions for reduced bond strength, and semiconductor device assemblies formed by the same
US-12582001-B2 · Mar 17, 2026 · US
Grindable heat sink for multiple die packaging
US-2026068668-A1 · Mar 5, 2026 · US
Memory die bonding in stacked semiconductor systems
US-2026040582-A1 · Feb 5, 2026 · US
Logic-uppermost semiconductor device assemblies with reconstituted wafers and multi-reticle dies coupled by reticle-bridging conductors
US-2026041008-A1 · Feb 5, 2026 · US
Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods
US-2025385205-A1 · Dec 18, 2025 · US
Monolithic conductive column in a semiconductor device and associated methods
US-2025336774-A1 · Oct 30, 2025 · US
Monolithic conductive column in a semiconductor device and associated methods
US-12424516-B2 · Sep 23, 2025 · US
Monolithic conductive cylinder in a semiconductor device and associated methods
US-12424517-B2 · Sep 23, 2025 · US
Recent patents
Latest publications not already listed above.
Methods and apparatus for integrating carbon nanofiber into semiconductor devices using w2w fusion bonding
US-2025246511-A1 · Jul 31, 2025 · US
Die-to-die probe pad connection in a stacked semiconductor device
US-2025226324-A1 · Jul 10, 2025 · US
Bond pads for semiconductor die assemblies and associated methods and systems
US-2025218990-A1 · Jul 3, 2025 · US
Grindable heat sink for multiple die packaging
US-12300570-B2 · May 13, 2025 · US
Monolithic conductive columns in a semiconductor device and associated methods
US-2025140756-A1 · May 1, 2025 · US
Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods
US-12278202-B2 · Apr 15, 2025 · US
Stacked semiconductor device
US-2025096202-A1 · Mar 20, 2025 · US
Bond pads for semiconductor die assemblies and associated methods and systems
US-12255163-B2 · Mar 18, 2025 · US
Semiconductor device with layered dielectric
US-2025079366-A1 · Mar 6, 2025 · US
Buffer layer for chips on wafer semiconductor device assemblies
US-2025054898-A1 · Feb 13, 2025 · US
Methods of forming microelectronic device assemblies and packages
US-12199068-B2 · Jan 14, 2025 · US
Monolithic conductive columns in a semiconductor device and associated methods
US-12183716-B2 · Dec 31, 2024 · US
Monolithic conductive column in a semiconductor device and associated methods
US-2024379503-A1 · Nov 14, 2024 · US
Conductive pad on a through-silicon via
US-2024379596-A1 · Nov 14, 2024 · US
Semiconductor device with dual damascene and dummy pads
US-2024332229-A1 · Oct 3, 2024 · US
Methods and systems for manufacturing semiconductor devices
US-12080678-B2 · Sep 3, 2024 · US
Monolithic conductive column in a semiconductor device and associated methods
US-12074094-B2 · Aug 27, 2024 · US
Connecting semiconductor dies through traces
US-2024079369-A1 · Mar 7, 2024 · US
Semiconductor die stacks and associated systems and methods
US-2024071969-A1 · Feb 29, 2024 · US
Methods for fusion bonding semiconductor devices to temporary carrier wafers with cavity regions for reduced bond strength, and semiconductor device assemblies formed by the same
US-2024063207-A1 · Feb 22, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 91 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 82 |
| H01L25/0657 | 60 |
| H10W90/297 | 50 |
| H10W90/722 | 49 |
| H10W20/20 | 48 |