Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
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Oda Daizo patents
Oda Daizo is listed as an inventor on 100 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Oda Daizo |
| Total patents | 100 |
| First publication | Jun 16, 2015 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Bonding wire for semiconductor devices
US-12581982-B2 · Mar 17, 2026 · US
Al bonding wire
US-12532767-B2 · Jan 20, 2026 · US
Al ALLOY BONDING WIRE
US-2025379177-A1 · Dec 11, 2025 · US
Bonding wire for semiconductor devices
US-2025372565-A1 · Dec 4, 2025 · US
Copper bonding wire for semiconductor devices and semiconductor device
US-12463171-B2 · Nov 4, 2025 · US
AG alloy bonding wire for semiconductor devices and semiconductor device
US-12463172-B2 · Nov 4, 2025 · US
Bonding wire for semiconductor devices
US-12412864-B2 · Sep 9, 2025 · US
Al bonding wire
US-12388044-B2 · Aug 12, 2025 · US
Copper bonding wire
US-12334467-B2 · Jun 17, 2025 · US
Recent patents
Latest publications not already listed above.
AI wiring material
US-12325901-B2 · Jun 10, 2025 · US
Copper alloy bonding wire for semiconductor devices
US-12300658-B2 · May 13, 2025 · US
Bonding wire
US-12290883-B2 · May 6, 2025 · US
Bonding wire
US-2025114877-A1 · Apr 10, 2025 · US
Bonding wire for semiconductor devices
US-12166006-B2 · Dec 10, 2024 · US
Bonding wire
US-12132025-B2 · Oct 29, 2024 · US
Ai bonding wire for semiconductor devices
US-2024312946-A1 · Sep 19, 2024 · US
Al bonding wire
US-12090578-B2 · Sep 17, 2024 · US
Bonding wire for semiconductor devices
US-2024297142-A1 · Sep 5, 2024 · US
Bonding wire for semiconductor devices
US-2024290744-A1 · Aug 29, 2024 · US
Bonding wire for semiconductor devices
US-2024290743-A1 · Aug 29, 2024 · US
Bonding wire for semiconductor devices
US-2024290745-A1 · Aug 29, 2024 · US
Bonding wire for semiconductor devices
US-2024266313-A1 · Aug 8, 2024 · US
Ai wiring material
US-2024110262-A1 · Apr 4, 2024 · US
Ai wiring material
US-2024105668-A1 · Mar 28, 2024 · US
Bonding wire for semiconductor devices
US-11929343-B2 · Mar 12, 2024 · US
Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
US-2024071978-A1 · Feb 29, 2024 · US
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
US-2023402422-A1 · Dec 14, 2023 · US
Bonding wire for semiconductor devices
US-2023387066-A1 · Nov 30, 2023 · US
Al WIRING MATERIAL
US-2023302584-A1 · Sep 28, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nippon Micrometal Corp | 100 |
| Nippon Steel Chemical & Mat Co Ltd | 59 |
| Nippon Steel & Sumikin Mat Co | 32 |
| Uno Tomohiro | 1 |
| Terashima Shinichi | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/50 | 93 |
| H01L24/45 | 93 |
| H10W72/01565 | 82 |
| H10W72/5525 | 81 |
| H10W72/552 | 78 |