Bonding wire for semiconductor devices

Patent metadata

Field	Value
Publication number	US-12166006-B2
Application number	US-202218685871-A
Country	US
Kind code	B2
Filing date	Oct 18, 2022
Priority date	Jun 24, 2022
Publication date	Dec 10, 2024
Grant date	Dec 10, 2024

Abstract

A bonding wire includes a core material of Cu or Cu alloy, and a coating layer containing a conductive metal other than Cu on a surface of the core material. In a concentration profile in a depth direction of the wire obtained, an average value of sum of a Pd concentration C Pd (atomic %) and an Ni concentration C Ni (atomic %) for measurement points in the coating layer is 50 atomic % or more, an average value of a ratio of C Pd to C Ni for measurement points in the coating layer is from 0.2 to 20 and a thickness of the coating layer is from 20 nm to 180 nm. An Au concentration C Au at a surface of the wire is from 10 atomic % to 85 atomic %. An average size of crystal grains in a circumferential direction of the wire is from 35 nm to 200 nm.

First claim

The invention claimed is:

1. A bonding wire for semiconductor devices, the bonding wire comprising:
a core material of Cu or Cu alloy; and
a coating layer containing a conductive metal other than Cu formed on a surface of the core material, wherein
in a concentration profile in a depth direction of the wire obtained by performing measurement using Auger electron spectroscopy (AES), an average value of sum of a Pd concentration C Pd (atomic %) and an Ni concentration C Ni (atomic %), C Pd +C Ni , for measurement points in the coating layer is 50 atomic % or more, an average value of a ratio of C Pd to C Ni , C Pd /C Ni , for measurement points in the coating layer is 0.2 or more and 20 or less and a thickness dt of the coating layer is 20 nm or more and 180 nm or less,
an Au concentration C Au at a surface of the wire is 10 atomic % or more and 85 atomic % or less, and
an average size of crystal grains in a circumferential direction of the wire is 35 nm or more and 200 nm or less when the surface of the wire is analyzed by using an Electron Backscattered Diffraction (EBSD) method.

2. The bonding wire according to claim 1 , wherein in the concentration profile in the depth direction of the wire obtained by performing the measurement using AES, a thickness da of a region where an Au concentration C Au is 10 atomic % or more is 0.5 nm or more and 25 nm or less.

3. The bonding wire according to claim 1 , wherein when measuring crystal orientations on the surface of the wire by using the EBSD method, a crystal orientation <111> angled at 15° or less to a wire longitudinal direction has a proportion of 30% or more and 95% or less.

4. The bonding wire according to claim 1 , wherein the concentration profile in the depth direction of the wire is obtained by performing the measurement using AES under the following <Condition> while digging down the wire from its surface in the depth direction by Ar sputtering:
<Condition> a center of width of a measuring surface is aligned with a center of width of the wire, the width of the measuring surface is 5% or more and 15% or less of a diameter of the wire, and a length of the measuring surface is five times the width of the measuring surface.

5. The bonding wire according to claim 1 , wherein the concentration of Au at the surface of the wire is measured using AES under the following <Condition>:
<Condition> a center of width of a measuring surface is aligned with a center of width of the wire, the width of the measuring surface is 5% or more and 15% or less of a diameter of the wire, and a length of the measuring surface is five times the width of the measuring surface.

6. The bonding wire according to claim 1 , wherein
the bonding wire contains one or more elements selected from the group consisting of B, P, In and Mg (hereinafter referred to as a “first additive element”), and
a total concentration of the first additive element is 1 ppm by mass or more and 100 ppm by mass or less relative to the entire wire.

7. The bonding wire according to claim 1 , wherein
the bonding wire contains one or more elements selected from the group consisting of Se, Te, As and Sb (hereinafter referred to as a “second additive element”), and
a total concentration of the second additive element is 1 ppm by mass or more and 100 ppm by mass or less relative to the entire wire.

8. The bonding wire according to claim 1 , wherein
the bonding wire contains one or more elements selected from the group consisting of Ga, Ge and Ag (hereinafter referred to as a “third additive element”), and
a total concentration of the third additive element is 0.011% by mass or more and 1.5% by mass or less relative to the entire wire.

9. A semiconductor device comprising the bonding wire according to claim 1 .

Assignees

• Nippon Steel Chemical & Mat Co Ltd
• Nippon Micrometal Corp

Inventors

• Uno Tomohiro
• Oyamada Tetsuya
• Oda Daizo
• Eto Motoki

Classifications

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/01565

  Thermally treating · CPC title

• H10W72/01551

  Changing the shapes of bond wires · CPC title

• H10W72/01515

  Forming coatings · CPC title