Method of electroless gold plating
US-2016265115-A1 · Sep 15, 2016 · US
Bonding wire
US12132025B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12132025-B2 |
| Application number | US-202017437805-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 12, 2020 |
| Priority date | Mar 13, 2019 |
| Publication date | Oct 29, 2024 |
| Grant date | Oct 29, 2024 |
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- Title
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Abstract
Official abstract text for this publication.
There is provided a metal-coated Al bonding wire which can provide a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the metal-coated Al bonding wire is operated. The bonding wire includes a core wire of Al or Al alloy, and a coating layer of Ag, Au or an alloy containing them formed on the outer periphery of the core wire, and the bonding wire is characterized in that when measuring crystal orientations on a cross-section of the core wire in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <111> angled at 15 degrees or less to a wire longitudinal direction has a proportion of 30 to 90% among crystal orientations in the wire longitudinal direction. Preferably, the surface roughness of the wire is 2 μm or less in terms of Rz.
First claim
Opening claim text (preview).
The invention claimed is: 1. A bonding wire comprising: a core wire of Al or Al alloy; and a coating layer of Ag, Au or an alloy containing them formed on an outer periphery of the core wire, wherein when measuring crystal orientations on a cross-section of the core wire in a direction perpendicular to a wire axis of the bonding wire, a crystal orientation <111> angled at 15 degrees or less to a wire longitudinal direction has a proportion of 30 to 90% among crystal orientations in the wire longitudinal direction. 2. The bonding wire according to claim 1 , wherein a surface roughness of the wire is 2 μm or less in terms of Rz. 3. The bonding wire according to claim 1 , wherein a thickness of the coating layer is 1 to 100 nm. 4. The bonding wire according to claim 1 , wherein a wire diameter is 50 to 600 μm.
Assignees
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Classifications
comprising aluminium [Al] · CPC title
comprising gold [Au] · CPC title
Thermally treating · CPC title
of outermost layers of multilayered bond wires, e.g. material of a coating · CPC title
comprising metals or metalloids, e.g. silver · CPC title
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- What does patent US12132025B2 cover?
- There is provided a metal-coated Al bonding wire which can provide a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the metal-coated Al bonding wire is operated. The bonding wire includes a core wire of Al or Al alloy, and a coating layer of Ag, Au or an alloy containing them formed on the outer periphery of t…
- Who is the assignee on this patent?
- Nippon Micrometal Corp, Nippon Steel Chemical & Mat Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B32B15/017. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Oct 29 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).