Al bonding wire

Patent metadata

Field	Value
Publication number	US-12388044-B2
Application number	US-202017912824-A
Country	US
Kind code	B2
Filing date	Mar 25, 2020
Priority date	Mar 25, 2020
Publication date	Aug 12, 2025
Grant date	Aug 12, 2025

Abstract

There is provided an Al bonding wire which can achieve a sufficient bonding reliability of bonded parts of the bonding wire under a high temperature state where a semiconductor device using the Al bonding wire is operated. The Al bonding wire is characterized in that the wire contains 0.02 to 1% by mass of Fe, further contains 0.05 to 0.5% by mass in total of at least one or more of Mn and Cr, and the balance includes Al and inevitable impurities, wherein a total content of Fe, Mn and Cr in solid solution is 0.01 to 1% by mass. The Al bonding wire contains Mn and Cr in addition to Fe, so that Fe, Mn and Cr can be promoted to form a solid solution in quenching treatment after the solution treatment. Accordingly, the Al bonding wire can achieve an effect of solid-solution strengthening of the wire due to the increase in the total content of Fe, Mn and Cr in solid solution and an effect of preventing recrystallization from proceeding during use of the semiconductor device at a high temperature for a long time.

First claim

The invention claimed is:

1. An Al bonding wire consisting of 0.02 to 1% by mass of Fe and further 0.05 to 0.5% by mass in total of at least one or more of Mn and Cr, with the balance consisting of Al and inevitable impurities,
wherein a total content of Fe, Mn and Cr in solid solution is 0.01 to 1% by mass, and
in a cross-section perpendicular to a wire longitudinal direction, an area ratio of a crystal having a crystal orientation <111> angled at 15 degrees or less to the wire longitudinal direction is 30 to 90%.

2. The Al bonding wire according to claim 1 , wherein an average crystal grain size in a cross-section perpendicular to the wire longitudinal direction is 0.1 to 50 um.

3. The Al bonding wire according to claim 1 , wherein the Vickers hardness of the wire falls within a range from Hv20 to 40.

4. The Al bonding wire according to claim 1 , wherein the wire diameter is 50 to 600 um.

Assignees

• Nippon Micrometal Corp
• Nippon Steel Chemical & Mat Co Ltd

Inventors

• Yamada Takashi
• Nishibayashi Akihito
• Haibara Teruo
• Oda Daizo
• Eto Motoki
• Oyamada Tetsuya
• Kobayashi Takayuki
• Uno Tomohiro

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/50 Primary

  Bond wires · CPC title

• H01L2224/45171

  Electricity · mapped topic

• H01L2224/4516

  Electricity · mapped topic