Copper alloy bonding wire for semiconductor
US-9427830-B2 · Aug 30, 2016 · US
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Uno Tomohiro patents
Uno Tomohiro holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Aug 18, 2015 |
| Latest publication | Aug 30, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Bonding structure of bonding wire
US-9331049-B2 · May 3, 2016 · US
Bonding wire for semiconductor device
US-9112059-B2 · Aug 18, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Copper alloy bonding wire for semiconductor
US-9427830-B2 · Aug 30, 2016 · US
Bonding structure of bonding wire
US-9331049-B2 · May 3, 2016 · US
Bonding wire for semiconductor device
US-9112059-B2 · Aug 18, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W72/522 | 3 |
| H10W72/5363 | 3 |
| H10W72/536 | 3 |
| H10W72/5522 | 3 |
| H10W72/59 | 3 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Cross-Sectional Technologies | 2 |
| Operations & Transport | 1 |
| Chemistry & Metallurgy | 1 |