Copper alloy bonding wire for semiconductor devices

Patent metadata

Field	Value
Publication number	US-2026097454-A1
Application number	US-202519072796-A
Country	US
Kind code	A1
Filing date	Mar 6, 2025
Priority date	Jun 20, 2016
Publication date	Apr 9, 2026
Grant date	—

Abstract

In a copper alloy bonding wire for semiconductor devices, the bonding longevity of a ball bonded part under high-temperature and high-humidity environments is improved. The copper alloy bonding wire for semiconductor devices includes in total 0.03% by mass or more to 3% by mass or less of at least one or more kinds of elements selected from Ni, Zn, Ga, Ge, Rh, In, Ir, and Pt (first element), with the balance Cu and inevitable impurities. The inclusion of a predetermined amount of the first element suppresses production of an intermetallic compound susceptible to corrosion under high-temperature and high-humidity environments at the wire bonding interface and improves the bonding longevity of a ball bonded part.

First claim

1 . A copper alloy bonding wire for semiconductor devices, comprising:
one or more kinds of first elements selected from Ni, Zn, Ga, Ge, In and Ir, wherein the total content of the first elements is 0.05% by mass or more and 3% by mass or less; and 0.0001% by mass or more and 0.050% by mass or less of each of at one or more kinds of elements selected from P and Mg, with the balance comprising Cu and inevitable impurities, and the copper alloy bonding wire is a bare Cu alloy wire.

2 . A copper alloy bonding wire for semiconductor devices, comprising:
one or more kinds of first elements selected from Ni, Zn, Ga, Ge, In and Ir, wherein the total content of the first elements is 0.05% by mass or more; and in total 0.03% by mass or more of one or more kinds of elements selected from Rh and Pt, and total concentration of the elements and the first elements is 3% by mass or less, with the balance comprising Cu and inevitable impurities, and the copper alloy bonding wire is a bare Cu alloy wire.

3 . The copper alloy bonding wire for semiconductor devices according to claim 2 , wherein the copper alloy bonding wire further comprises 0.0001% by mass or more and 0.050% by mass or less of each of one or more kinds of elements selected from Ti, B, P, Mg, Ca, La, As, Te and Se, with respect to the entire wire.

4 . The copper alloy bonding wire for semiconductor devices according to any one of claims 1 to 3 , wherein an average crystal grain size (μm) in core cross section of the copper alloy bonding wire is

0.02
×
R

+

0.4

or
⁢

more

(

1
⁢
a

)

0.1
×
R

+

0.5

or
⁢

less

(

1
⁢
b

)

where R (μm) is a diameter of the wire and the core cross section is vertical to a wire axis of the copper alloy bonding wire.

5 . The copper alloy bonding wire for semiconductor devices according to any one of claims 1 to 4 , wherein an average film thickness of copper oxide on a surface of the wire is in a range of 0.0005 μm or more and 0.02 μm or less.

6 . The copper alloy bonding wire for semiconductor devices according to any one of claims 1 to 5 , wherein the copper alloy bonding wire further comprises in total 0.0005% by mass or more and 0.5% by mass or less of one or more kinds of elements selected from Ag and Au, with respect to the entire wire.

7 . The copper alloy bonding wire for semiconductor devices according to any one of claims 1 to 6 , wherein the copper alloy bonding wire further comprises 1.15% by mass or less of Pd.

8 . The copper alloy bonding wire for semiconductor devices according to any one of claims 1 to 7 , wherein the copper alloy bonding wire comprises two or more kinds of first elements selected from Ni, Zn, Ga, Ge, In and Ir.

Assignees

• Nippon Micrometal Corp
• Nippon Steel Chemical & Mat Co Ltd

Inventors

• Oda Daizo
• Yamada Takashi
• Eto Motoki
• Haibara Teruo
• Uno Tomohiro

Classifications

• H10W72/5525

  comprising copper [Cu] · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• C22C9/06

  with nickel or cobalt as the next major constituent · CPC title

• C22C9/04

  with zinc as the next major constituent · CPC title