Current measuring circuit
US-12292469-B2 · May 6, 2025 · US
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Nelhiebel Michael patents
Nelhiebel Michael is listed as an inventor on 34 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nelhiebel Michael |
| Total patents | 34 |
| First publication | Mar 19, 2015 |
| Latest publication | May 6, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Scanning electron microscopy-based sample analysis
US-2025022681-A1 · Jan 16, 2025 · US
Current Measuring Circuit
US-2023194595-A1 · Jun 22, 2023 · US
Prognostic health management for power devices
US-11443990-B2 · Sep 13, 2022 · US
Semiconductor device power metallization layer with stress-relieving heat sink structure
US-11276624-B2 · Mar 15, 2022 · US
Prognostic health management for power devices
US-2021407870-A1 · Dec 30, 2021 · US
Semiconductor device and a method of forming the semiconductor device
US-11171049-B2 · Nov 9, 2021 · US
Barrier for power metallization in semiconductor devices
US-11127693-B2 · Sep 21, 2021 · US
Semiconductor Device Power Metallization Layer with Stress-Relieving Heat Sink Structure
US-2021183732-A1 · Jun 17, 2021 · US
Method of manufacturing a semiconductor device having a power metallization structure
US-10978395-B2 · Apr 13, 2021 · US
Recent patents
Latest publications not already listed above.
Semiconductor device with copper structure
US-10937720-B2 · Mar 2, 2021 · US
Method of Manufacturing a Semiconductor Device Having a Power Metallization Structure
US-2020335448-A1 · Oct 22, 2020 · US
Power metallization structure for semiconductor devices
US-10734320-B2 · Aug 4, 2020 · US
Semiconductor device with compressive interlayer
US-10700019-B2 · Jun 30, 2020 · US
Barrier for Power Metallization in Semiconductor Devices
US-2020111754-A1 · Apr 9, 2020 · US
Power Metallization Structure for Semiconductor Devices
US-2020035610-A1 · Jan 30, 2020 · US
Semiconductor device having a copper element and method of forming a semiconductor device having a copper element
US-10446469-B2 · Oct 15, 2019 · US
Semiconductor Device with Copper Structure
US-2019304884-A1 · Oct 3, 2019 · US
Semiconductor Device with Compressive Interlayer
US-2019273050-A1 · Sep 5, 2019 · US
Semiconductor device and a method of forming the semiconductor device
US-2019267283-A1 · Aug 29, 2019 · US
Semiconductor device having a load current component and a sensor component
US-10396067-B2 · Aug 27, 2019 · US
Self-organizing barrier layer disposed between a metallization layer and a semiconductor region
US-10332793-B2 · Jun 25, 2019 · US
Compressive interlayer having a defined crack-stop edge extension
US-10304782-B2 · May 28, 2019 · US
Semiconductor Device Having a Load Current Component and a Sensor Component
US-2019157258-A1 · May 23, 2019 · US
Semiconductor device including self-protecting current sensor
US-10249612-B2 · Apr 2, 2019 · US
Compressive Interlayer Having a Defined Crack-Stop Edge Extension
US-2019067209-A1 · Feb 28, 2019 · US
Electrically conductive element, power semiconductor device having an electrically conductive element and method of manufacturing a power semiconductor device
US-9812376-B2 · Nov 7, 2017 · US
Self-organizing barrier layer disposed between a metallization layer and a semiconductor region
US-2017154813-A1 · Jun 1, 2017 · US
Apparatus and method for testing electric conductors
US-9523729-B2 · Dec 20, 2016 · US
Semiconductor Device Having a Copper Element and Method of Forming a Semiconductor Device Having a Copper Element
US-2016329263-A1 · Nov 10, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 23 |
| Infineon Technologies Austria Ag | 12 |
| Detzel Thomas | 1 |
| Gross Johann | 1 |
| Illing Robert | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/425 | 11 |
| H01L23/53238 | 9 |
| H10W42/00 | 8 |
| H01L2924/0002 | 6 |
| H10W72/01255 | 6 |