Semiconductor package having a high reliability
US-12183718-B2 · Dec 31, 2024 · US
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Min Tae-Hong patents
Min Tae-Hong is listed as an inventor on 43 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Min Tae-Hong |
| Total patents | 43 |
| First publication | Feb 19, 2015 |
| Latest publication | Dec 31, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package having a high reliability
US-2024145437-A1 · May 2, 2024 · US
Semiconductor package having a high reliability
US-11894346-B2 · Feb 6, 2024 · US
Inductor device and method of manufacturing the same
US-11769622-B2 · Sep 26, 2023 · US
Semiconductor package having a high reliability
US-2023207533-A1 · Jun 29, 2023 · US
Semiconductor package having a high reliability
US-11664352-B2 · May 30, 2023 · US
Printed circuit board
US-11558961-B2 · Jan 17, 2023 · US
Printed circuit board and package including printed circuit board
US-11272613-B2 · Mar 8, 2022 · US
Printed circuit board and package having the same
US-11122694-B2 · Sep 14, 2021 · US
Semiconductor package having a high reliability
US-2021280564-A1 · Sep 9, 2021 · US
Recent patents
Latest publications not already listed above.
Semiconductor package having a high reliability
US-11018115-B2 · May 25, 2021 · US
Printed circuit board
US-2020383208-A1 · Dec 3, 2020 · US
Semiconductor package having a high reliability
US-2020219853-A1 · Jul 9, 2020 · US
Printed circuit board and package including printed circuit board
US-2020178389-A1 · Jun 4, 2020 · US
Printed circuit board and package having the same
US-2020178401-A1 · Jun 4, 2020 · US
Printed circuit board
US-2020163228-A1 · May 21, 2020 · US
Semiconductor package having a high reliability
US-10622335-B2 · Apr 14, 2020 · US
Circuit board and manufacturing method thereof
US-10362667-B2 · Jul 23, 2019 · US
Inductor device and method of manufacturing the same
US-2019139696-A1 · May 9, 2019 · US
Semiconductor package having a high reliability
US-2019096856-A1 · Mar 28, 2019 · US
Semiconductor package having a high reliability
US-10153255-B2 · Dec 11, 2018 · US
Circuit board and manufacturing method thereof
US-10064291-B2 · Aug 28, 2018 · US
Semiconductor device having stacked semiconductor chips interconnected via TSV
US-10020290-B2 · Jul 10, 2018 · US
Circuit board and assembly thereof
US-9992865-B2 · Jun 5, 2018 · US
Circuit board
US-9832856-B2 · Nov 28, 2017 · US
Circuit board and manufacturing method thereof
US-2017251548-A1 · Aug 31, 2017 · US
Semiconductor package having a high reliability
US-2017243857-A1 · Aug 24, 2017 · US
Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same
US-9721926-B2 · Aug 1, 2017 · US
Circuit board
US-9655229-B2 · May 16, 2017 · US
Printed circuit board and method for manufacturing the same
US-2017094773-A1 · Mar 30, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 26 |
| Samsung Electronics Co Ltd | 17 |
| Choe Yeong Hwan | 1 |
| Hwang Tae Joo | 1 |
| Min Tae Hong | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 30 |
| H10W70/60 | 18 |
| H10W90/722 | 17 |
| H10W74/15 | 17 |
| H10W72/252 | 17 |