Circuit board

Patent metadata

Field	Value
Publication number	US-9832856-B2
Application number	US-201615002720-A
Country	US
Kind code	B2
Filing date	Jan 21, 2016
Priority date	Apr 8, 2015
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes an insulating part, a heat-transfer body disposed in the insulating part, the heat-transfer body including a thermally conductive material formed in a column shape, and a function hole penetrating the heat-transfer body between a top surface and a bottom surface of the heat-transfer body.

First claim

What is claimed is:

1. A circuit board comprising:
a first insulating layer having a cavity formed therein;
a circuit pattern disposed on at least one surface of the first insulating layer;
a heat-transfer body disposed in the cavity, the heat-transfer body comprising a thermally conductive material and formed in a column shape and electrically disconnected from the circuit pattern;
a second insulating layer covering the first insulating layer and the heat-transfer body;
a function hole penetrating the heat-transfer body between a top surface and a bottom surface of the heat-transfer body;
a first surface of a first via in contact with a top surface of the heat-transfer body;
a first metal pattern in contact with a second surface of the first via; and
a first coupling member connected to the first metal pattern,

wherein an insulating material is filled in the function hole, and the insulating material is integrally formed with the second insulating layer.

2. The circuit board as set forth in claim 1 , wherein the function hole is formed near a center of the heat-transfer body.

3. The circuit board as set forth in claim 1 , wherein:
the first coupling member is connectable with a first electronic component; and
the first electronic component comprises a first area and a second area, the second area having a higher temperature than the first area during an operation.

4. The circuit board as set forth in claim 3 , wherein at least a portion of the heat-transfer body is placed vertically below the first electronic component.

5. The circuit board as set forth in claim 4 , wherein an area of a top surface of the heat-transfer body corresponds to a width of the second area of the first electronic component.

6. The circuit board as set forth in claim 4 , further comprising:
a second via having a surface in contact with a bottom surface of the heat-transfer body;
a second metal pattern in contact with another surface of the second via; and
a second coupling member connected to the second metal pattern,
wherein a heat from the heat-transfer body moves to the second coupling member through the second via and the second metal pattern.

7. The circuit board as set forth in claim 1 , wherein a primer layer is formed on a surface of the heat-transfer body, the primer layer being configured to adhere the heat-transfer body to the first insulating layer.

8. The circuit board as set forth in claim 1 , wherein a primer is formed on a surface of the heat-transfer body, and the first via penetrates the primer to be in contact with the top surface of the heat-transfer body.

Assignees

• Samsung Electro Mech

Inventors

• Min Tae-Hong
• Kang Myung-Sam
• Ko Young-Gwan

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title