Printed circuit board and package having the same

Patent metadata

Field	Value
Publication number	US-2020178401-A1
Application number	US-201916676493-A
Country	US
Kind code	A1
Filing date	Nov 7, 2019
Priority date	Dec 4, 2018
Publication date	Jun 4, 2020
Grant date	—

Abstract

A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.

First claim

1 . A printed circuit board comprising:
a laminate comprising stacked insulating layers including a rigid insulating layer; a flexible insulating layer comprising a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.

2 . The printed circuit board of claim 1 , further comprising a second antenna disposed in the laminate and overlapping the first antenna.

3 . The printed circuit board of claim 1 , further comprising an additional antenna disposed in the laminate,
wherein the additional antenna is of a different type from the first antenna.

4 . The printed circuit board of claim 1 , further comprising a second flexible insulating layer comprising a partial region disposed inside the laminate and a remaining region disposed outside of the laminate

5 . The printed circuit board of claim 4 , further comprising a circuit pattern disposed at an end of the remaining region of the flexible insulating layer; and
an additional antenna disposed at an end of the remaining region of the second flexible insulating layer.

6 . The printed circuit board of claim 4 , wherein the flexible insulating layer and the second flexible insulating layer extend outside the laminate in a same direction.

7 . The printed circuit board of claim 4 ,
wherein the flexible insulating layer and the second flexible insulating layer comprise a plurality of layers, respectively.

8 . The printed circuit board of claim 4 , wherein the flexible insulating layer and the second flexible insulating layer are different layers, and
at least one of the insulating layers is interposed between the flexible insulating layer and the second flexible insulating layer.

9 . The printed circuit board of claim 4 , wherein the flexible insulating layer and the second flexible insulating layer extend outside the laminate in different directions.

10 . The printed circuit board of claim 1 , wherein the rigid insulating layer comprises:
a first rigid insulating layer; and a second rigid insulating layer disposed on both sides of the first rigid insulating layer, and the first rigid insulating layer is thicker than the second rigid insulating layer.

11 . The printed circuit board of claim 10 , wherein the first antenna and the flexible insulating layer are disposed on opposite sides of the first rigid insulating layer.

12 . The printed circuit board of claim 10 , further comprising a second antenna disposed in the laminate and overlapping the first antenna,
wherein the second antenna is disposed on a surface of the first rigid insulating layer.

13 . The printed circuit board of claim 1 , further comprising a solder resist layer stacked on at least one side of the laminate.

14 . The printed circuit board of claim 13 , wherein the flexible insulating layer is in contact with the solder resist layer.

15 . A module comprising:
a laminate comprising stacked insulating layers including a rigid insulating layer; a flexible insulating layer comprising a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; a first antenna disposed on a first surface of the laminate; and an electronic element disposed on a second surface of the laminate, wherein the electronic element comprises at least one of an integrated circuit and a passive element.

16 . The module of claim 15 , further comprising a second antenna disposed in the laminate and overlapping the first antenna.

17 . The module of claim 15 , further comprising an additional antenna disposed in the laminate,
wherein the additional antenna is of a different type from the first antenna.

18 . The module of claim 15 , further comprising a second flexible insulating layer comprising a partial region disposed inside the laminate and a remaining region disposed outside of the laminate.

19 . The module of claim 18 , further comprising a circuit pattern disposed at an end of the remaining region of the flexible insulating layer, and
an additional antenna disposed at an end of the remaining region of the second flexible insulating layer.

20 . The module of claim 18 , wherein the flexible insulating layer and the second flexible insulating layer extend outside the laminate in the same direction.

21 . The module of claim 18 ,
wherein the flexible insulating layer and the second flexible insulating layer comprise a plurality of layers, respectively.

22 . The module of claim 18 , wherein the flexible insulating layer and the second flexible insulating layer are different layers, and
at least one of the insulating layers is interposed between the flexible insulating layer and the second flexible insulating layer.

23 . The module of claim 15 , wherein the rigid insulating layer comprises:
a first rigid insulating layer; and a second rigid insulating layer disposed on both sides of the first rigid insulating layer, and the first rigid insulating layer is thicker than the second rigid insulating layer.

24 . The module of claim 23 , wherein the first antenna and the flexible insulating layer are disposed on opposite sides of the first rigid insulating layer.

25 . The module of claim 23 , further comprising a second antenna disposed in the laminate and overlapping the first antenna,
wherein the second antenna is disposed on a surface of the first rigid insulating layer.

26 . The module of claim 15 , further comprising a solder resist layer stacked on at least one side of the laminate.

27 . The module of claim 26 , wherein the flexible insulating layer is in contact with the solder resist layer.

28 . The printed circuit board of claim 1 , wherein the flexible insulating layer comprises one or both of an insulating layer comprising a liquid crystal polymer (LCP) and an insulating layer comprising a polyphenylene ether (PPE).

29 . The module of claim 15 , wherein the flexible insulating layer comprises one or both of an insulating layer comprising a liquid crystal polymer (LCP) and an insulating layer comprising a polyphenylene ether (PPE).

Assignees

• Samsung Electro Mech

Inventors

• Min Tae-Hong
• Kim Ju-Ho

Classifications

• H05K3/4691 Primary

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K2201/0187

  with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K1/145

  Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title