Circuit board

Patent metadata

Field	Value
Publication number	US-9655229-B2
Application number	US-201514938900-A
Country	US
Kind code	B2
Filing date	Nov 12, 2015
Priority date	Nov 13, 2014
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.

First claim

What is claimed is:

1. A circuit board, comprising:
a first thermally conductive structure comprising
a cavity or a recess portion, wherein at least a portion of the first thermally conductive structure is inserted into an insulating part,
a first structure layer comprising a via hole, and
a second structure layer integrated on an upper surface of the first structure layer and a lower surface of the first structure layer by filling a material inside the via hole.

2. The circuit board of claim 1 , wherein the first structure layer comprises invar and the second structure layer comprises copper.

3. The circuit board of claim 1 , wherein the first structure layer comprises graphite or graphene.

4. A circuit board, comprising:
a first insulating layer comprising a first cavity;
a first thermally conductive structure comprising a second cavity, wherein a portion of the second cavity is inserted into the first cavity;
an electronic device comprising a portion inserted into the second cavity;
a second insulating layer covering an upper portion of the first insulating layer, the first thermally conductive structure, and the electronic device;
a third insulating layer covering a lower portion of the first insulating layer, the first thermally conductive structure, and the electronic device;
a first via comprising an end in contact with the first thermally conductive structure by passing through the second insulating layer;
a second via comprising an end in contact with the first thermally conductive structure by passing through the third insulating layer;
a third via comprising an end in contact with the electronic device by passing through the second insulating layer; and
a fourth via comprising an end in contact with the electronic device by passing through the third insulating layer.

5. The circuit board of claim 4 , wherein a first electronic component is formed on an upper portion of the circuit board and at least a portion of the electronic device is positioned at a vertically downward region of the first electronic component.

6. The circuit board of claim 5 , wherein the electronic device is a decoupling capacitor and the third via is operatively connected to a power source terminal of the first electronic component.

7. The circuit board of claim 5 , wherein the first electronic component comprises a first region and a second region, wherein a temperature in the second region is higher than a temperature of the first region during an operation of the first electronic component, and
wherein a metal pattern is in contact with a joining portion, which is in contact with at least a portion of the second region, and is in contact with another end of the first via.

8. The circuit board of claim 4 , further comprising:
a first metal pattern in contact with another end of the first via; and
a second metal pattern in contact with another end of the third via,
wherein heat flowing through the first metal pattern is greater than heat flowing through the second metal pattern.

9. The circuit board of claim 8 , wherein a first electronic component is mounted on an upper portion of the circuit board,
wherein the first electronic component comprises a first region and a second region,
wherein a temperature of the second region increases more than a temperature of the first region during an operation of the first electronic component, and
wherein at least a portion of the second region is connected with the first metal pattern using a joining portion.

10. The circuit board of claim 4 wherein a first electronic component is mounted on an upper portion of the circuit board, and at least a portion of the first thermally conductive structure is positioned at a vertically downward region from the first electronic component.

11. The circuit board of claim 4 , further comprising:
an adhesion improving portion formed on a surface of the first thermally conductive structure configured to increase adhesion between the first thermally conductive structure and at least one of the first insulating layer, the second insulating layer, and the third insulating layer.

12. The circuit board of claim 11 , wherein the adhesion improving portion comprises a primer comprising acrylic silane.

13. The circuit board of claim 4 , wherein the first thermally conductive structure comprises a hexahedron form with the upper surface and the lower surface thereof.

14. The circuit board of claim 4 , further comprising:
a first metal pattern in contact with another end of the first via;
a second metal pattern in contact with another end of the second via;
a third metal pattern in contact with another end of the third via; and
a fourth metal pattern in contact with another end of the fourth via.

15. The circuit board of claim 14 , wherein a first joining portion is in contact with the first metal pattern, and a first electronic component is in contact with the first joining portion.

16. The circuit board of claim 15 , wherein a second joining portion is in contact with the second metal pattern, and an additive substrate is in contact with the second joining portion, and
wherein heat generated from the first electronic component is transmitted to the additive substrate through the first joining portion, the first metal pattern, the first via, the first thermally conductive structure, the second via, the second metal pattern, and the second joining portion.

17. The circuit board of claim 16 , wherein the second joining portion is operatively connected on an upper surface of a heat sink, wherein the upper surface and a lower surface of the heat sink are exposed through the additive substrate, and wherein the additive substrate comprises a thermally conductive material.

18. The circuit board of claim 16 , wherein the first electronic component comprises a first region and a second region of which clock speed is greater than that of the first region,
wherein a distance from the second region to the first joining portion is shorter than that from the first region to the first joining portion.

Assignees

• Samsung Electro Mech

Inventors

• Min Tae-Hong
• Kang Myung-Sam
• Ko Young-Gwan

Classifications

• H05K2201/09136

  Means for correcting warpage · CPC title

• H05K3/4602

  characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated · CPC title

• H05K1/0231

  Capacitors or dielectric substances · CPC title

• H05K1/0206 Primary

  by printed thermal vias · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title