Circuit board and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10362667-B2
Application number	US-201715594085-A
Country	US
Kind code	B2
Filing date	May 12, 2017
Priority date	Feb 23, 2015
Publication date	Jul 23, 2019
Grant date	Jul 23, 2019

Abstract

A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.

First claim

What is claimed is:

1. A circuit board, comprising:
insulation layers;
a structure for heat transfer, wherein at least a portion of the structure for heat transfer is inserted into at least a portion of the insulation layers;
metal layers formed on one or more surfaces of each of the insulation layers; and
vias that penetrate at least one of the insulation layers to connect at least two of the metal layers with one another,
wherein the structure for heat transfer comprises
a first layer, formed of graphite or graphene,
a second layer, located on one surface of the first layer and formed of metallic material,
a third layer, located on the other surface of the first layer and formed of metallic material, and
penetration holes that penetrate through the first layer and are filled with the same metallic material as the metallic material that forms the second layer and the third layer,
wherein a boundary surface between the first layer and the second layer or a boundary surface between the first layer and the third layer is perpendicular to a boundary between the insulation layers, and
wherein no boundaries are formed between the second layer, the third layer and the metallic material filled in the penetration holes.

2. The circuit board of claim 1 , wherein an XY plane of graphite or graphene is formed in parallel with the boundary surface between the first layer and the second layer.

3. The circuit board of claim 2 , wherein the first layer is formed in plural, and the plurality of first layers are arranged to be spaced apart from one another so as to form the structure for heat transfer.

4. The circuit board of claim 1 , further comprising:
a first insulation layer, comprising a cavity into which at least a portion of the structure for heat transfer is inserted;
a first via, penetrating a second insulation layer that is located above the first insulation layer;
a second via, penetrating a third insulation layer that is located below the first insulation layer;
a first metal pattern, located on an outer surface of the second insulation layer and in contact with one end of the first via; and
a second metal pattern, located on an outer surface of the third insulation layer and in contact with one end of the second via,
wherein the boundary surface between the first layer and the second layer and the boundary layer between the first layer and the third layer are perpendicular to the boundary surface between the first insulation layer and the second insulation layer.

Assignees

• Samsung Electro Mech

Inventors

• Min Tae-Hong
• Kang Myung-Sam
• Lee Jung-Han
• Ko Young-Gwan

Classifications

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H05K2201/0338

  Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title

• H05K3/4608

  comprising an electrically conductive base or core · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H05K1/182

  associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title