Printed circuit board

Patent metadata

Field	Value
Publication number	US-2020163228-A1
Application number	US-201916664113-A
Country	US
Kind code	A1
Filing date	Oct 25, 2019
Priority date	Nov 15, 2018
Publication date	May 21, 2020
Grant date	—

Abstract

A printed circuit board includes: an insulating material; a metal layer disposed on a first surface of the insulating material and including an opening; a pad disposed along a second surface of the insulating material; a via hole penetrating through the insulating material and extending from the pad to the opening; and a conductor disposed along the opening and the via hole. A diameter of a portion of the via hole adjacent to the opening is smaller than a diameter of a portion of the opening adjacent to the via hole.

First claim

What is claimed is:

1 . A printed circuit board comprising:
an insulating material; a metal layer disposed on a first surface of the insulating material and comprising an opening; a pad disposed along a second surface of the insulating material; a via hole penetrating through the insulating material and extending from the pad to the opening; and a conductor disposed along the opening and the via hole, wherein a diameter of a portion of the via hole adjacent to the opening is smaller than a diameter of a portion of the opening adjacent to the via hole.

2 . The printed circuit board of claim 1 , wherein the diameter of the portion of the via hole adjacent to the opening is smaller than a diameter of a portion of the opening opposite the portion of the opening adjacent to the via hole.

3 . The printed circuit board of claim 1 , wherein the conductor comprises:
a seed layer continuously disposed along an inner surface of the opening and an inner surface of the via hole; and an electroplating layer disposed on the seed layer.

4 . The printed circuit board of claim 3 , wherein the seed layer extends along a surface of the metal layer.

5 . The printed circuit board of claim 4 , wherein the electroplating layer extends through the opening and on the metal layer.

6 . The printed circuit board of claim 5 , wherein the electroplating layer comprises:
a first electroplating layer disposed inside the via hole; a second electroplating layer disposed inside the opening; and a third electroplating layer disposed on the metal layer and the second electroplating layer, wherein a width of the third electroplating layer is greater than a width of the second electroplating layer.

7 . The printed circuit board of claim 1 , wherein a ratio of a depth of the via hole to the diameter of the portion of the opening adjacent to the via hole is greater than 0.66 and less than 0.83.

8 . The printed circuit board of claim 1 , wherein the insulating material comprises:
a first resin layer; and a second resin layer stacked on the first resin layer, and comprising a material different from a material of the first resin layer.

9 . The printed circuit board of claim 8 , wherein the first resin layer comprises a thermosetting resin, and
the second resin layer comprises a thermoplastic resin.

10 . The printed circuit board of claim 1 , wherein a ratio of a diameter of a portion of the via hole adjacent to the pad to the diameter of the portion of the via hole adjacent to the opening is greater than 0.8 and less than 1.

11 . The printed circuit board of claim 3 , wherein a thickness of the metal layer is greater than a thickness of the seed layer.

12 . A printed circuit board comprising:
an insulating material; a first pad disposed along a first surface of the insulating material; a via penetrating through the insulating material and disposed on the first pad; and a second pad disposed on the via, wherein the second pad comprises: a metal layer having a ring shape and disposed on a second surface of the insulating material so as not to overlap the via; a seed layer continuously disposed along the second surface of the insulating material, an inner surface of the metal layer, and a surface of the metal layer; and an electroplating layer disposed on the seed layer.

13 . The printed circuit board of claim 12 , wherein an inner diameter of the metal layer is greater than a diameter of a portion of the via adjacent to the metal layer.

14 . The printed circuit board of claim 12 , wherein a ratio of a thickness of the via to an inner diameter of the metal layer is greater than 0.66 and less than 0.83.

15 . The printed circuit board of claim 12 , wherein the insulating material comprises:
a first resin layer; and a second resin layer stacked on the first resin layer, and comprising a material different from a material of the first resin layer.

16 . The printed circuit board of claim 15 , wherein the first resin layer comprises a thermosetting resin, and
the second resin layer comprises a thermoplastic resin.

17 . A printed circuit board comprising:
an insulating material; a pad disposed in the insulating material along a first surface of the insulating material; a metal layer disposed on a second surface of the insulating material and comprising an opening that at least partially overlaps the pad in a thickness direction of the printed circuit board; a via hole connecting the pad to the opening; and a conductor disposed in the via hole.

18 . The printed circuit board of claim 17 , wherein the opening completely overlaps the pad in the thickness direction of the printed circuit board.

19 . The printed circuit board of claim 18 , wherein the conductor comprises a seed layer having a stepwise structure extending from the metal layer to the pad.

Assignees

• Samsung Electro Mech

Inventors

• Lee Sa-Yong
• Min Tae-Hong

Classifications

• H05K1/188

  manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component · CPC title

• H05K3/361 Primary

  Assembling flexible printed circuits with other printed circuits · CPC title

• H01L23/4985

  Electricity · mapped topic

• H10W70/688

  Flexible insulating substrates · CPC title

• H05K2203/0542

  Continuous temporary metal layer over metal pattern · CPC title