Circuit board and assembly thereof

Patent metadata

Field	Value
Publication number	US-9992865-B2
Application number	US-201615045544-A
Country	US
Kind code	B2
Filing date	Feb 17, 2016
Priority date	Feb 24, 2015
Publication date	Jun 5, 2018
Grant date	Jun 5, 2018

Abstract

A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.

First claim

What is claimed is:

1. A circuit board assembly, comprising:
an additional board comprising a first external connection member and a second external connection member that are exposed through one surface;
a first electronic component embedded in a circuit board to contact the first external connection member with an external contact; and
the circuit board disposed on an upper portion of the first electronic component and the additional board, the circuit board being electrically connected to the second external connection member and being in contact with the first electronic component,
wherein the circuit board comprises:
a core part having a recess in which at least a portion of the first electronic component is inserted,
a first lower conductive pattern, one surface of the first lower conductive pattern being in contact with a lower surface of a through via, and other surface of the first lower conductive pattern being connected to the second external connection member,
a first insulation film, one surface of the first insulation film being in contact with an upper surface of the core part,
a first conductive pattern, one surface of the first conductive pattern being in contacted with the other surface of the first insulation film,
a second insulation film, one surface of the second insulation film being in contacted with the other surface of the first conductive pattern, and
a second conductive pattern, one surface of the second conductive pattern being in contact with the other surface of the second insulation film,
wherein the second insulation film comprises:
an insulation thin film contacting the first conductive pattern, and
a function film disposed on the insulation thin firm and contacting the second conductive pattern.

2. The circuit board assembly of claim 1 , wherein the insulation thin film comprises parylene, and the function film comprises titanium nitride (TiN).

3. The circuit board assembly of claim 1 , wherein at least a portion of the first conductive pattern is in contact with an upper surface of the through via.

4. The circuit board assembly of claim 1 , wherein at least a portion of the second conductive pattern penetrates through the second insulation film to be contacted with the first conductive pattern.

5. The circuit board assembly of claim 1 , wherein the circuit board further comprises a third external connection member electrically contacted with the second conductive pattern,
wherein the circuit board assembly further comprises a second electronic component contacted with the third external connection member.

6. The circuit board assembly of claim 2 , wherein the core part comprises a metallic material,
wherein the first insulation film comprises
a parylene film, one surface of the parylene film being in contacted with the core part, and
a titanium nitride film, one surface of the titanium nitride film being in contact with the parylene film, and other surface of the titanium nitride film being in contact with one surface of the first conductive pattern.

7. The circuit board assembly of claim 6 , wherein at least one among outer surfaces of the first electronic component directly contacts the metallic material of the core part.

Assignees

• Samsung Electro Mech

Inventors

• Min Tae-Hong
• Kang Myung-Sam
• Ko Young-Gwan
• Seong Min-Jae

Classifications

• H05K2201/10674

  Flip chip · CPC title

• H05K2201/09872

  Insulating conformal coating · CPC title

• H05K2201/09672

  Superposed layout, i.e. in different planes · CPC title

• H05K2201/0367

  Metallic bump or raised conductor not used as solder bump · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title