Printed circuit board and package including printed circuit board

Patent metadata

Field	Value
Publication number	US-11272613-B2
Application number	US-201916674460-A
Country	US
Kind code	B2
Filing date	Nov 5, 2019
Priority date	Dec 4, 2018
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.

First claim

What is claimed is:

1. A printed circuit board, comprising:
a laminate including a core layer and insulating layers vertically stacked on first and second sides of the core layer;
a first antenna formed on a surface of the laminate; and
a flexible insulating layer including a region in vertical contact with one of the insulating layers and vertically overlapping the core layer, and a remaining region disposed outside the laminate such that the remaining region does not vertically overlap the laminate,
wherein a thickness of the core layer is greater than a thickness of the one of the insulating layers, and
wherein a material of the core layer is different from a material of the one of the insulating layers.

2. The printed circuit board of claim 1 , wherein a dielectric dissipation factor of the core layer is lower than a dielectric dissipation factor of the one of the insulating layers.

3. The printed circuit board of claim 1 , wherein a rigidity of the core layer is less than or equal to a rigidity of the one of the insulating layers.

4. The printed circuit board of claim 1 , further comprising a second antenna formed on a surface of the core layer.

5. The printed circuit board of claim 1 , further comprising an additional antenna formed in the laminate such that the first antenna and the additional antenna are located on opposite sides with respect to the core layer.

6. The printed circuit board of claim 1 , wherein a circuit pattern is disposed in or on the flexible insulating layer, in the remaining region.

7. The printed circuit board of claim 1 , wherein an additional antenna is disposed at an end of the flexible insulating layer located outside the laminate.

8. The printed circuit board of claim 1 , wherein the flexible insulating layer comprises a thermoplastic resin layer and a thermosetting resin layer that are vertically stacked.

9. The printed circuit board of claim 8 , further comprising a circuit disposed on and protruding from the thermoplastic resin layer,
wherein at least a portion of the circuit is embedded in the thermosetting resin layer.

10. The printed circuit board of claim 1 , wherein the one of the insulating layers comprises a thermoplastic resin layer and a thermosetting resin layer that are vertically stacked.

11. The printed circuit board of claim 1 , wherein another one of the insulating layers comprises a thermoplastic resin layer and a thermosetting resin layer that are vertically stacked.

12. The printed circuit board of claim 1 , further comprising a solder resist layer stacked on either one or both of first and second sides of the laminate.

13. A module, comprising:
a laminate including a core layer and insulating layers vertically stacked on first and second sides of the core layer;
a first antenna formed on a surface of the laminate;
an electronic element mounted on another surface of the laminate; and
a flexible insulating layer including a region in vertical contact with one of the insulating layers and vertically overlapping the core layer, and a remaining region disposed outside the laminate such that the remaining region does not vertically overlap the laminate,
wherein the electronic element comprises either one or both of an integrated circuit and a passive element, and
wherein a thickness of the core layer is greater than a thickness of the one of the insulating layers, and
wherein a material of the core layer is different from a material of the one of the insulating layers.

14. The module of claim 13 , wherein a dielectric dissipation factor of the core layer is lower than a dielectric dissipation factor of the one of the insulating layers.

15. The module of claim 13 , wherein a rigidity of the core layer is less than or equal to a rigidity of the one of the insulating layers.

16. The module of claim 13 , further comprising a second antenna formed on a surface of the core layer.

17. The module of claim 13 , further comprising an additional antenna formed in the laminate such that the first antenna and the additional antenna are disposed on opposite sides with respect to the core layer.

18. The module of claim 13 , wherein a circuit pattern is formed in or on the flexible insulating layer, in the remaining region.

19. The module of claim 13 , wherein an additional antenna is formed at an end of the flexible insulating layer located outside the laminate.

20. The module of claim 13 , wherein the flexible insulating layer comprises a thermoplastic resin layer and a thermosetting resin layer that are vertically stacked.

21. The module of claim 20 , further comprising a circuit disposed on and protruding from the thermoplastic resin layer,
wherein at least a portion of the circuit is embedded in the thermosetting resin layer.

22. The module of claim 13 , wherein the one of the insulating layers comprises a thermoplastic resin layer and a thermosetting resin layer that are vertically stacked.

23. The module of claim 13 , wherein another one of the insulating layers comprises a thermoplastic resin layer and a thermosetting resin layer that are vertically stacked.

24. The module of claim 13 , further comprising a solder resist layer stacked on either one or both of first and second sides of the laminate.

25. The printed circuit board of claim 8 , wherein the thermoplastic resin layer comprises a liquid crystal polymer (LCP).

26. The printed circuit board of claim 8 , wherein the thermosetting resin layer comprises a polyphenylene ether (PPE).

27. The printed circuit board of claim 10 , wherein the thermoplastic resin layer comprises a liquid crystal polymer (LCP).

28. The printed circuit board of claim 10 , wherein the thermosetting resin layer comprises a polyphenylene ether (PPE).

29. The printed circuit board of claim 11 , wherein the thermoplastic resin layer comprises a liquid crystal polymer (LCP).

30. The printed circuit board of claim 11 , wherein the thermosetting resin layer comprises a polyphenylene ether (PPE).

31. The module of claim 20 , wherein the thermoplastic resin layer comprises a liquid crystal polymer (LCP).

32. The module of claim 20 , wherein the thermosetting resin layer comprises a polyphenylene ether (PPE).

33. The module of claim 22 , wherein the thermoplastic resin layer comprises a liquid crystal polymer (LCP).

34. The module of claim 22 , wherein the thermosetting resin layer comprises a polyphenylene ether (PPE).

35. The module of claim 23 , wherein the thermoplastic resin layer comprises a liquid crystal polymer (LCP).

36. The module of claim 23 , wherein the thermosetting resin layer comprises a polyphenylene ether (PPE).

37. The printed circuit board of claim 1 , wherein a dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.

38. The module of claim 13 , wherein a dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.

39. The printed circuit board of claim 1 , wherein the first antenna comprises a pattern formed in or directly on another one of the insulating layers.

Assignees

• Samsung Electro Mech

Inventors

• Min Tae-Hong
• Kim Ju-Ho

Classifications

• H05K1/165 Primary

  incorporating printed inductors · CPC title

• H05K3/4691

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• H05K3/4602

  characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated · CPC title

• H05K1/0298 Primary

  Multilayer circuits · CPC title

• H05K1/024 Primary

  Dielectric details, e.g. changing the dielectric material around a transmission line · CPC title