Printed circuit board

Patent metadata

Field	Value
Publication number	US-2020383208-A1
Application number	US-201916662094-A
Country	US
Kind code	A1
Filing date	Oct 24, 2019
Priority date	May 29, 2019
Publication date	Dec 3, 2020
Grant date	—

Abstract

A printed circuit board includes a first insulating layer having a through hole, and a via disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, wherein the via includes a plating layer having an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer, and a metal paste layer including metal particles, and filled in the rest of the through hole and disposed on the plating layer.

First claim

What is claimed is:

1 . A printed circuit board comprising:
a first insulating layer comprising a through hole; and a via disposed to fill the through hole and to be extended to at least one surface of the first insulating layer, wherein the via comprises:
a plating layer comprising an inner wall part disposed on an inner wall of the through hole and a land part extended from the inner wall part and disposed on the at least one surface of the first insulating layer; and
a metal paste layer comprising metal particles, and filled in the rest of the through hole and disposed on the plating layer.

2 . The printed circuit board of claim 1 , wherein the plating layer is extended to both surfaces of the first insulating layer and further comprises a middle part extended from the inner wall part to block the through hole to divide the inner space of the through hole.

3 . The printed circuit board of claim 1 , wherein the metal paste layer disposed on the first insulating layer comprises a flat surface and further comprises a metal layer disposed thereon.

4 . The printed circuit board of claim 3 , wherein a land of the via comprises the plating layer, the metal paste layer and the metal layer sequentially laminated.

5 . The printed circuit board of claim 4 , further comprising a first circuit pattern disposed on the first insulating layer, wherein the first circuit pattern comprises the plating layer, the metal paste layer, and the metal layer sequentially laminated.

6 . The printed circuit board of claim 1 , wherein the land part in the plating layer is extended to one surface of the first insulating layer and the via further comprises a land plating layer disposed on the other surface of the first insulating layer to cover the metal paste layer.

7 . The printed circuit board of claim 6 , wherein the metal paste layer protrudes on the land part on the one surface of the first insulating layer and is embedded by the land plating layer on the other surface of the first insulating layer.

8 . The printed circuit board of claim 1 , further comprising a second insulating layer disposed on the first insulating layer and embedding the via; and
a second circuit pattern disposed on the second insulating layer.

9 . The printed circuit board of claim 1 , further comprising an antenna disposed on a first surface of the at least one surface and connected by the via to an electronic component disposed on a second surface of the at least one surface opposite to the first surface.

10 . An antenna module board, comprising:
a printed circuit board comprising:
a first insulating layer comprising a through hole from a first surface to a second surface opposite the first surface,
a conductor plating disposed on a surface of the through hole and one or more of the first surface and the second surface, and
a conductor metal paste comprising metal particles and disposed on the conductor plating in the through hole and on the one or more of the first surface and the second surface; and
an antenna disposed on the first surface connected by the conductor plating and conductor metal paste to an electronic component disposed on the second surface.

11 . The antenna module board of claim 10 , wherein the conductor plating disposed on the surface of the through hole comprises a middle part dividing an inner space from the first surface to the second surface into two cavities, and the conductor metal paste fills the two cavities.

12 . The antenna module board of claim 10 , wherein the conductor plating disposed on the surface of the through hole comprises an inner space from the first surface to the second surface, and the conductor metal paste fills the space.

13 . The antenna module board of claim 12 , wherein the conductor plating is disposed on one of the first surface and the second surface and a land plating layer is disposed on the other of the first surface and the second surface to cover the metal paste layer.

14 . The antenna module board of claim 10 , further comprising a metal layer disposed on a flat surface of the conductor metal paste disposed on the conductor plating on the one or more of the first surface and the second surface.

15 . The antenna module board of claim 14 , further comprising a first circuit pattern formed on the first insulating layer, wherein the first circuit pattern comprises the conductor plating, the conductor metal paste and the metal layer sequentially laminated.

16 . The antenna module board of claim 15 , further comprising a second insulating layer disposed on the first insulating layer and embedding the conductor plating, the conductor metal paste, and the metal layer; and
a second circuit pattern disposed on the second insulating layer and connected to the antenna.

Assignees

• Samsung Electro Mech

Inventors

• Choi Jungwoo
• Min Tae-Hong

Classifications

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K3/42

  Plated through-holes {or plated via connections} · CPC title

• H05K3/4623

  the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence) · CPC title